Patent classifications
Y10T428/31536
Resin blend for melting process
Provided are a resin blend for forming a layer-separated structure, a pellet, a method of preparing a resin article using the same and a resin article. The resin blend may include a first resin, and a second resin that comprises a resin to which at least one organic functional group selected from the group consisting of an alkyl group having 2 to 20 carbon atoms, an alicyclic group having 5 to 40 carbon atoms and an aromatic group having 6 to 40 carbon atoms is introduced, that has a difference in melt viscosity from the first resin of 0.1 to 3000 pa*s at a shear rate of 100 to 1000 s.sup.1 and a processing temperature of the resin blend, and that has a difference in glass transition temperature from the first resin of 10 C. to 150 C. The resin blend can improve mechanical and surface characteristics of a resin article.
Resin blend for melting process
The present invention relates to a resin blend for a melting process, to a method for manufacturing a resin molding using same, and to a resin molding obtained thereby, the resin blend comprising a first resin and a second resin, wherein the second resin includes a polymer resin having at least one organic functional group selected from the group consisting of an alkyl group having 2 to 20 carbon atoms, an alicyclic ring having 5 to 40 carbon atoms and an aromatic ring having 6 to 40 carbon atoms, and has, with the first resin, a melt viscosity difference of 0.1 to 3,000 Pa*s at a shear rate of 100 to 1,000 s.sup.1 and a processing temperature of the resin mixture, and a glass transition temperature (T.sub.g) difference of 10 C. to 150 C.
Composite material with adhesion promoter layer based on Si, C and O
A composite material includes: a substrate and a polymer layer which are interconnected by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the substrate includes a metal substrate or a polymer substrate.
ENCAPSULATION STRUCTURE, ELECTRONIC DEVICE AND ENCAPSULATION METHOD
An encapsulation structure, an encapsulation method and an electronic device are provided. The encapsulation structure includes an inorganic layer, an aluminum carbon layer and an organic layer. The aluminum carbon layer is on the inorganic layer and contacts with the inorganic layer; the organic layer is on the aluminum carbon layer and contacts with the aluminum carbon layer.
COMPOSITE MATERIAL WITH ADHESION PROMOTER LAYER BASED ON SI, C AND O
A composite material includes: a metal substrate and a polymer layer which are directly interconnected by an adhesion promoter layer. The adhesion promoter layer is obtained by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the organosilicon compound includes a siloxane, silane, or silicate.
POLYMER COATINGS
The present disclosure relates to polymer coatings covalently attached to the surface of a substrate and the preparation of the polymer coatings, such as poly(N-(5-azidoacetamidylpentyl)acrylamide-co-acrylamide) (PAZAM), in the formation and manipulation of substrates, such as molecular arrays and flow cells. The present disclosure also relates to methods of preparing a substrate surface by using beads coated with a covalently attached polymer, such as PAZAM, and the method of determining a nucleotide sequence of a polynucleotide attached to a substrate surface described herein.
Bonding material composition, aluminum nitride bonded body, and method for producing the same
A first bonding material composition according to the present invention is a bonding material composition used when aluminum nitride sintered bodies containing a rare-earth metal oxide are bonded to each other, in which the bonding material composition contains, in addition to an O element-containing aluminum nitride raw material, (a) as a fluorine compound, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, or (b) as a fluorine compound, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, and a rare-earth metal oxide.
Polymer coatings
The present disclosure relates to polymer coatings covalently attached to the surface of a substrate and the preparation of the polymer coatings, such as poly(N-(5-azidoacetamidylpentyl)acrylamide-co-acrylamide) (PAZAM), in the formation and manipulation of substrates, such as molecular arrays and flow cells. The present disclosure also relates to methods of preparing a substrate surface by using beads coated with a covalently attached polymer, such as PAZAM, and the method of determining a nucleotide sequence of a polynucleotide attached to a substrate surface described herein.
Heat-resistant member and method for manufacturing the same
A heat-resistant member according to the present invention includes a member to be protected and a metal oxide ceramic protective layer which is disposed on part of or all surfaces of the member to be protected and which has a porosity of 0 percent by volume or more and 5 percent by volume or less. This heat-resistant member is produced through the step of forming a protective layer by firing a member to be protected provided with a metal raw material in the air in a temperature range lower than the melting point of an oxide of the metal raw material to form a metal oxide ceramic protective layer having a porosity of 0 percent by volume or more and 5 percent by volume or less on part of or all surfaces of the member to be protected.
Mono-layer thin film adhesive compounds and methods of synthesis and use
The invention relates provides synthetic medical adhesives which exploit plant derivatives to form covalent bonds with amines and thiols on tissue surfaces.