The present invention is directed to a polyimide resin comprising a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine, wherein the structural unit A contains a structural unit (A-1) derived from 4,4-(hexafluoroisopropylidene)diphthalic anhydride, and the structural unit B contains a structural unit derived from an aliphatic diamine, a polyimide resin composition comprising the polyimide resin and inorganic nanoparticles, and a polyimide film comprising the polyimide resin or the polyimide resin composition. Provided are a polyimide resin and a polyimide resin composition, each of which can form a film having not only a heat resistance, and colorlessness and transparency but also low water absorption properties, and a polyimide film.

The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.

A composition comprises, based on the total weight of the composition, 50 wt % to 90 wt % of a polyetherimide; and 10 wt % to 50 wt % of a filler comprising talc, titanium dioxide, zirconium oxide, neutral aluminum oxide, or a combination comprising at least one of the foregoing; wherein the composition has a number of drops to tracking at 250 volts of greater than or equal to 50 drops determined according to ASTM D-3638-85.

The invention describes novel coating agents that include a polymer, one or more latent reactive groups and one or more noncovalent linking groups, the noncovalent linking groups selected to interact with a substrate to which the coating agent is applied. The coating agents are useful for providing a coating that can be further functionalized (for example, by application of additional coating layers), or for providing desirable properties to a surface.

Provided is a flexible and self-supporting insulating film including a base support layer and a partially cured poly(amide)imide layer applied to the base support layer. The composite insulating film may be used as slot liner to provide insulation to the components of the electric motor. The partially cured poly(amide)imide layer of the composite insulation film maybe further cured by the heat generated by the operation of the electric motor.

A heating article includes a substrate having two opposite surfaces, at least one of which is opaque, and a heat-stable coating arranged on the opaque surface. The heat-stable coating includes an at least two-color decoration having continuous tones and being provided in the form of a continuous or discontinuous layer.

A substrate comprising a crosslinked polymer primer layer, and grafted thereto a ligand-functionalized polymer is provided. The grafted polymer has the requisite affinity for binding neutral or negatively charged biomaterials, such as cells, cell debris, bacteria, spores, viruses, nucleic acids, and proteins, at pH's near or below the pI's of the biomaterials.

Exemplary embodiments provide a fuser member containing an intermediate layer and methods for forming the intermediate layer and the fuser member. In one embodiment, the fuser member can include a substrate, a resilient layer, a surface layer and an intermediate layer disposed between the resilient layer (e.g., a silicone rubber layer) and the surface layer (e.g., a fluoroplastic of PFA or PTEE). The intermediate layer can include a CNT/polymer composite containing a plurality of carbon nanotubes in a polymer matrix. The surface layer and the fuser member can thus be treated at a temperature of about 250 C. or higher.

The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface including an adhesive layer and a protective layer laminated on the adhesive layer, in which the protective layer is constituted of a heat-resistant resin having a glass transition temperature of 200 C. or more or a metal.

Insulated winding wires and associated methods for forming winding wires are described. A winding wire may include a conductor and insulation formed around the conductor. The insulation may provide a partial discharge inception voltage greater than approximately 1,000 volts and a dielectric strength greater than approximately 10,000 volts. Additionally, the insulation may be capable of withstanding a continuous operating temperature of approximately 220 C. without degradation. The insulation may include at least one base layer formed around an outer periphery of the conductor, and an extruded thermoplastic layer formed around the base layer. The extruded layer may include at least one of polyetheretherketone (PEEK) or polyaryletherketone (PAEK).