Patent classifications
Y10T428/31721
Chemical film on substrate, method of forming the same, and method of forming N-hydroxysuccinimide ester-functionalized paracyclophane
The present invention provides a method of forming N-hydroxysuccinimide ester-functionalized paracyclophane. The present method is carried out by adding 4-carboxyl-paracyclophane into N,N′-Dicyclohexylcarbodiimide (DCC) and N-Hydroxysuccinimide (NHS) to form N-hydroxysuccinimide ester-functionalized paracyclophane. The present invention further provides a chemical film on a substrate and a method of forming the same, wherein the chemical film includes N-hydroxysuccinimide ester-functionalized poly-para-xylylene.
Composite plate structure and flexible apparatus
A composite plate structure including a flexible substrate and a release layer is provided. The flexible substrate has an upper surface and a lower surface. The release layer is disposed on the lower surface of the flexible substrate, and includes a hydrophobic material and a bonding material. The hydrophobic material includes at least one fluorine atom. The bonding material at least includes an amide functional group or an epoxy functional group. The bonding material is bonded to the flexible substrate through the amide functional group or the epoxy functional group. A flexible apparatus including the composite plate structure is also provided.
Photoaligning material
The present invention relates to a copolymer for the photoalignment of liquid crystals comprising a photoreactive group as given below in formula (I), compositions thereof, and its use for optical and electro optical devices, especially liquid crystal devices (LCDs).
Transparent film, transparent electro-conductive laminate, and touch panel, solar cell, and display device using the same
A transparent electro-conductive laminate comprising: a substrate film made of a polyimide; and a thin film made of an electro-conductive material and stacked on the substrate film, wherein the polyimide is a polyimide containing at least one repeating unit represented by the following general formula (1): ##STR00001##
[in the formula (1), R.sup.1, R.sup.2, and R.sup.3 each independently represent one selected from the group consisting of a hydrogen atom, alkyl groups having 1 to 10 carbon atoms, and a fluorine atom, R.sup.4 represents an aryl group having 6 to 40 carbon atoms, and n represents an integer of 0 to 12], having a glass transition temperature of 350° C. to 450° C., and having a linear expansion coefficient of 30 ppm/° C. or less, the linear expansion coefficient being determined by measuring change in length under a nitrogen atmosphere and under a condition of a rate of temperature rise of 5° C./minute in a temperature range from 50° C. to 200° C.
Barium copper sulfur fluoride transparent conductive thin films and bulk material
A p-type transparent conductive material can comprise a thin film of BCSF on a substrate where the film has a conductivity of at least 1 S/cm. The substrate may be a plastic substrate, such as a polyethersulfone, polyethylene terephthalate, polyimide, or some other suitable plastic or polymeric substrate.
Matte finish polyimide films and methods relating thereto
The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.
Polyimide resin, polyimide resin composition, and polyimide film
The present invention is directed to a polyimide resin comprising a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine, wherein the structural unit A contains a structural unit (A-1) derived from 4,4′-(hexafluoroisopropylidene)diphthalic anhydride, and the structural unit B contains a structural unit derived from an aliphatic diamine, a polyimide resin composition comprising the polyimide resin and inorganic nanoparticles, and a polyimide film comprising the polyimide resin or the polyimide resin composition. Provided are a polyimide resin and a polyimide resin composition, each of which can form a film having not only a heat resistance, and colorlessness and transparency but also low water absorption properties, and a polyimide film.
POLYMER FILMS AND ELECTRONIC DEVICES
In a first aspect, a polymer film includes a polyimide, wherein the polyimide includes two or more dianhydrides, including 15 to 35 mol % of a first monomer that is a crankshaft monomer and 15 to 35 mol % of a second monomer that is a flexible monomer, and two or more diamines, including 1 to 35 mol % of a third monomer that is a rotational inhibitor monomer and 15 to 49 mol % a fourth monomer that is a rigid rotational monomer, wherein the mol % of each monomer is based on the total of all four monomers. The polymer film has a dielectric dissipation loss factor, D.sub.f, of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m.sup.2×day) or less.
Window cover film and flexible display panel including the same
The present invention relates to a window cover film and a flexible display panel including the same. More particularly, the present invention relates to a window cover film including a base layer, a hard coating layer, and an anti-fingerprint layer, and a flexible display panel including the same.
POLYMER FILMS AND ELECTRONIC DEVICES
In a first aspect, a polymer film includes a polyimide, wherein the polyimide includes two or more dianhydrides, including a first monomer that is a crankshaft monomer and a second monomer that is a rigid non-rotational monomer, and one or more diamines including a third monomer that is a flexible monomer. The crankshaft monomer and the flexible monomer include a combined 65 to 99 mol % of the total of all three monomers. The rigid non-rotational monomer includes 1 to 35 mol % of the total of all three monomers. The polymer film has a dielectric dissipation loss factor, D.sub.f, of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m.sup.2×day) or less.