Provided is such a conductive member that a change in its electrical resistance value caused by its long-term use is reduced to the extent possible. The conductive member has a conductive support and a conductive layer, the conductive layer contains a rubber composition formed of a modified epichlorohydrin rubber, and the modified epichlorohydrin rubber has a unit represented by the following formula (1). In the formula (1), R1, R2, and R3 each independently represent hydrogen or a saturated hydrocarbon group having 1 to 18 carbon atoms. ##STR00001##

A barrier film including a substrate; a base polymer layer adjacent to the substrate; an oxide layer adjacent to the base polymer layer; a adhesion-modifying layer adjacent to the oxide layer; and a top coat polymer layer adjacent to the adhesion-modifying layer. An optional inorganic layer can be applied over the top coat polymer layer. The inclusion of a adhesion-modifying layer provides for enhanced resistance to moisture and improved peel strength adhesion of the top coat polymer layer to the underlying barrier stack layers.

A thermoplastic polymer advanceable by solid state polymerization is blended with at least one dissimilar thermoplastic polymer. The blend is solid state polymerized to provide a modified polymer alloy blend having at least one physical or chemical property different from that of the blend before solid state polymerization. The modified polymer alloy blend may be coextruded with a layer of thermoplastic extrusion polymer having a melt viscosity similar to that of the modified polymer alloy.

The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates; thereby making an electronic device more firm with higher shock resistance.

Diecuts are configured for permanent closing of holes and have a carrier comprising an assembly of at least two polymeric films. An upper film of the at least two polymeric films has a basis weight of at least 1.0 kg/m.sup.2 and a lower film of the at least two polymeric films consisting of at least two layers, wherein a first layer is in the form of a polymeric film and faces the upper film, and a second layer is in the form of a functional layer with a side of the lower film, facing away from the upper film, bears an applied adhesive composition.

Methods for forming multi-layer substrates including top and bottom surface layers and a melt softened thermoplastic material layer between the exterior surface layers, where the thermoplastic material includes polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100 F.-350 F. The 3 (or more) layers are assembled, and heated, melt softening the thermoplastic material, causing bonding of the thermoplastic layer to the exterior surface layers. A cleaning composition may be loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel between the surface layers. Adhesion between the surface layers and the thermoplastic layer is provided by the thermoplastic material itself, which bonds to groups of fibers in the surface layers. The process does not require chemical adhesives, any processing water, drying, or the like, so as to be possible with low capital investment.

A lineal product includes a composite pultruded substrate having a solid outer surface, and a multi-layer coating extruded directly onto the outer surface. The coating comprises a solid extruded base layer comprising a first thermoplastic material extruded onto the outer surface, the base layer having a base-layer inner surface in intimate contact with the outer surface and a base-layer outer interface. The coating further comprises a solid extruded outer layer comprising a second thermoplastic material comprising polymethyl methacrylate extruded onto the first thermoplastic material, the solid extruded outer layer having an outer-layer interface in intimate contact with the base-layer outer interface and an outer-layer outer surface, wherein the intimate contact between the base-layer outer interface and the outer-layer interface forms a solid interface between the base layer and the outer layer. The solid extruded outer layer has a hardness of at least 1H pencil hardness.

Waterproof engineered floor and wall planks have a veneer layer bonded with a plastic composite core, and an underlayer, preferably an underlayer of cork.

A flow medium for assisting a resin to be transferred into a mold accommodating a layered structure of reinforced material is provided. The flow medium is configured such that when the resin is cured the flow medium becomes incorporated within a final composite component comprising the reinforced material embedded within the transferred and cured resin. A semifinished product comprising such a flow medium is provided and a method for producing a composite component by utilizing such a semifinished product is also provided.

A multi-layered article including a substrate; a release layer including polyvinyl alcohol and at least one cross-linking agent; and a first selective light modulator layer; wherein the release layer crosslinks and is water insoluble is disclosed. Also, disclosed is a multi-layered article including a substrate; a waterborne release layer; and a first selective light modulator layer including a cross-linking agent. Methods of making the multi-layered articles are also disclosed.