The disclosure relates to curable polysilyl phosphate compounds and compositions as well as related methods and flame-retardant textiles incorporating the same. Curable polysilyl phosphate compounds according to the disclosure include a hydrocarbon moiety comprising at least one phosphate group and more than two hydrolysable silyl groups linked to the hydrocarbon moiety. In some embodiments, the hydrocarbon moiety is derived from spirocyclic pentaerythritol diphosphoryl chloride. The curable polysilyl phosphate compound can applied to a textile substrate and then cured to provide a flame-retardant textile with the cured polysilyl phosphate compound as a coating bonded to the textile substrate.

A fibrous insulation product with improved thermal resistance and method of making it are provided. A plurality of base fibers (e.g. glass) are formed into an insulation product, which may be bindered or unbonded. At least one infrared opacifying agent, such as soot, carbon black or graphite, is applied to the fibrous insulation product such that the base fibers are substantially uniformly coated with opacifying agent. The opacifying agent may be applied, for example, from a fluid suspension or by pulling the fiber through a sooty flame. When opacifying agent applied via a suspension and a binder is desired, it is preferable to avoid binder dispersions that can dislocate the opacifying agent. Alternative binder applications may include co-mingling of base fibers with binder fibers, or other physical or mechanical distributions.

Disclosed are composite building boards and associated manufacturing methods. The composite boards may include, for example, one or more slurry layers with embedded fibrous mats. An exterior plastic coating is mechanically adhered to the underlying slurry layer. The plastic layer chemically bonds and cross-links with polymer additives within the slurry layer. The result is an integrated polymer matrix with greatly improved durability and surface strength.

A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern.

A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an aldehyde or ketone and an amine salt of an inorganic acid. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the fiberglass is in the form of building insulation. In other embodiments the product is a microglass-based substrate for use in a printed circuit board, battery separator, filter stock, or reinforcement scrim.

A joined body includes a first member, a second member, and a joining portion disposed therebetween and joining the first member and the second member. The joining portion includes a first joining layer on a side toward the first member and formed of a first joining material, a second joining layer on a side toward the second member and formed of a second joining material, and a metal layer therebetween and having a plurality of holes communicating with one another. The metal layer includes a first-joining-material-impregnated layer on a side toward the first joining layer and in which the plurality of holes are impregnated with the first joining material, a second-joining-material-impregnated layer on a side toward the second joining layer and in which the plurality of holes are impregnated with the second joining material, and an unfilled hole layer therebetween and in which the plurality of holes are void.