The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

A method for manufacturing a separable electromagnetic inductive apparatus is provided. The method for manufacturing a separable electromagnetic inductive apparatus comprises a winding step for winding a steel plate composed of a rolled amorphous magnetic alloy to a circular shape to form a magnetic core; a heat treating and an impregnating step for heat treating and impregnating the wound magnetic core without adding cobalt; a cutting step for cutting the heat treated and impregnated magnetic core to an orthogonal direction to the wound direction of the magnetic core; and a polishing step for polishing the cut surface having a three-dimensional plane of the cut surface of the magnetic core evenly arranged in a fixed state.

Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

A method for manufacturing a separable electromagnetic inductive apparatus is provided. The method for manufacturing a separable electromagnetic inductive apparatus comprises a winding step for winding a steel plate composed of a rolled amorphous magnetic alloy to a circular shape to form a magnetic core; a heat treating and an impregnating step for heat treating and impregnating the wound magnetic core without adding cobalt; a cutting step for cutting the heat treated and impregnated magnetic core to an orthogonal direction to the wound direction of the magnetic core; and a polishing step for polishing the cut surface having a three-dimensional plane of the cut surface of the magnetic core evenly arranged in a fixed state.

A system for laminating photovoltaic stacks comprising at least two sealed independent housings, each sealed housing delimiting an inner volume configured to contain one of the photovoltaic stacks and at least one evacuation port; a docking station, which comprises at least two independent compartments for receiving one of the sealed housings; heating means configured for heating each photovoltaic stack independently; an evacuation device for evacuating the inner volume of the sealed housings via the evacuation port; and a transfer device for transferring each sealed housing into one of the receiving compartments.

A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

In a method for producing stacks of laminations, in which at least one adhesive is applied onto annular laminations with at least one application head and laminations are stacked into a stack of laminations, the lamination is rotated about its axis in the application area of the application head and/or the application head is moved about the axis of the lamination in order to apply the adhesive onto the lamination. A system for carrying out the method features at least one punching tool, with which laminations are punched out of a sheet metal material, wherein at least one station for cleaning and/or for activating and/or for applying an adhesive onto the laminations is arranged downstream of the punching tool.

In a method for producing stacks of laminations, in which at least one adhesive is applied onto annular laminations with at least one application head and laminations are stacked into a stack of laminations, the lamination is rotated about its axis in the application area of the application head and/or the application head is moved about the axis of the lamination in order to apply the adhesive onto the lamination. A system for carrying out the method features at least one punching tool, with which laminations are punched out of a sheet metal material, wherein at least one station for cleaning and/or for activating and/or for applying an adhesive onto the laminations is arranged downstream of the punching tool.