A combination component handling and connecting device connectable to a multi-axis robot for use in moving and connecting components and subassemblies includes a housing and an actuator fixedly connected to the housing. The actuator includes an actuating link movable from a first position to a second position. Connected to the actuating link is an end effector for concurrent movement with the actuating link. The component handling and connecting device includes a clamp having a first jaw and a second jaw. The second jaw is connected to the actuating link for selectively moving the second jaw toward the first jaw operative to engage a component.

A production management system is configured so as to make it possible to produce component mounting boards to the same specifications in two lanes of a component mounting machine using one set of NC data by arranging feeders of two feeder set bases in the same manner and setting the mounting order of the components to the circuit boards in the two lanes to be the same in a same-direction production mode in which circuit boards are conveyed in the same front/back direction in the two lanes. In addition, the arrangement of the feeders and the mounting order of the components are optimized so that the difference in production times in the two lanes in the same-direction production mode is minimized.

To provide a mounting fixture for a motor driver and a method of mounting the motor driver. A mounting fixture is used for mounting a motor driver on a power magnetics cabinet. The mounting fixture has a rod-like shape of a smaller diameter than multiple mounting holes of the motor driver. For mounting of the motor driver by fixing the mounting holes and multiple screw holes of the power magnetics cabinet with screws, the mounting fixture is inserted in advance into the mounting hole and the screw hole. The mounting fixture is fixed in any screw hole of the power magnetics cabinet. The position of the mounting hole of the motor driver is determined using the mounting fixture. The motor driver is fixed to the power magnetics cabinet with the screws.

A computer automatic assembly system is proposed. The computer automatic assembly system includes: a database for storing information of an assembly and mounting area of a part combined to a mainboard, and program information such as information of a BIOS, a driving driver, and an operating system, and periodically updating the corresponding information through a communication part including a wired/wireless communication network; a device digestive module for checking the part through a photographing means, moving the checked part to the assembly and mounting area of the part provided on the mainboard through the photographing means and a robot arm for transfer, assembling, and mounting the part, and then writing a driving program and circuit information of the part; and an administrator terminal for periodically upgrading or updating part information necessary for the device digestive module by a part company server through a communication network including the wired/wireless communication network.

An electronic component mounting system stores: manufacturing plan data for each manufacturing lot; unit management data including use permission information indicating a use permission status of an equipment unit; and inventory data indicating a stock status of the equipment units. In a unit reservation processing, new allocation processing is performed for allocating an equipment unit necessary for manufacture of a new manufacturing lot to an equipment unit for a new manufacturing lot, and an allocation result is registered. The system determines whether an equipment unit of an allocation subject in the new allocation processing can be allocated to an equipment unit for the new manufacturing lot by referring to use permission information of the equipment unit, and if the equipment unit is determined as being usable, the unit reservation processing is performed.

While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.

A work head unit that detects the rotational position of suction nozzle with first Q-axis encoder positioned facing component holding section that holds a component. With the work head unit, it is desirable to detect the orientation of component holding section at two locations: suction nozzle and syringe member.

A system including multiple inspection machines and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.

A method comprises mounting a grounding clip to a planar flexible printed circuit transmission line; clamping the grounding clip to an inner wall of a chassis of an electronic device; and operating a laser beam to weld the grounding clip to the chassis to route the flexible printed circuit transmission line along the inner wall. Welding the grounding clip to the chassis causes the grounding clip to remain in contact with the planar flexible printed circuit transmission line to ground the planar flexible printed circuit transmission line to the chassis.

Semiconductor packages are described which increase the density of electronic components within. The semiconductor package may incorporate interposers with cavities formed into the top and/or bottom. The cavities may then be used as locations for the electronic components. Alternatively, narrow spacer interposers may be used to space apart standard more laterally elongated interposers to form the indentations used to house the electronic components. The semiconductor package designs described herein may be used to reduce footprint, reduce profile and increase electronic component and transistor density for semiconductor products.