An integrated circuit package comprising a heat spreader; one or more substrate(s); one or more standoff(s); and one or more electronic component(s). One or more component(s) is/are coupled to a substrate and the substrate maybe coupled to a heat spreader. Standoff(s) are coupled on the heat spreader or substrates forming a cavity, and one or more component(s) and substrate(s) are located inside the cavity.

A method for assembling a camera suitable for use for a vision system of a vehicle includes providing a circuit board having first and second sides separated by a thickness dimension of the circuit board. An imager is disposed at the first side of the circuit board and solder pads are disposed at the second side of the circuit board. The solder pads are in electrical connection with circuitry of the circuit board. A coaxial connector is aligned at the solder pads at the second side of the circuit board. The coaxial connector is soldered at the second side of the circuit board via melting the solder paste at the solder pads.

A component supply device comprises: a main body including a tape path which guides a component supply tape being sent in a longitudinal direction to a component supply position, and an introducing region which communicates with the tape path on a side opposite to the supply position in the longitudinal direction and introduces the supply tape into the tape path; and a tape position switching mechanism which switches the position of the supply tape in a vertical direction with respect to the tape path on the side opposite to the supply position. The tape position switching mechanism includes a supporter movable between a supporting position for supporting the supply tape from below and a non-supporting position separated from the supporting position in a width direction of the supply tape. The supporter releases the supply tape to move the supply tape downward from the supporting position to the non-supporting position.

The three-dimensional mounting device includes a supporting section capable of fixing a processing target, an application section for applying a viscous fluid to the processing target, a mounting section for arranging a component on the processing target, an imaging section for imaging the processing target, and a control section for controlling the processing section including the supporting section, the application section, the mounting section, and the imaging section. One or more of the supporting section, the application section, the mounting section, and the imaging section has multiple tilt axes and is capable of tilting the processing target and/or the processing section in multiple directions. The control section performs coordinate correction using the circuit pattern on the forming surface as a reference position, and arranges the component on the mounting section.

A component mounting machine includes multiple component supplying devices, a head, a head moving device, and a nozzle lifting and lowering device. The component supplying device feeds out a component to a component supply position. The head includes multiple nozzles configured to suction a component. The head moving device moves the head to cause the nozzles to face the respective component supply positions with two or more thereof. The nozzle lifting and lowering device lifts and lowers the nozzle located to face the component supply positions. In positioning the nozzles to face the respective component supply positions, the head is moved so as to prioritize a positional correction of a nozzle facing a smallest sized component over positional corrections of the other nozzles, and in this state, the nozzles facing the respective component supply positions are lifted and lowered simultaneously to suction corresponding components.

A support pin arrangement determination assisting apparatus including a display unit which displays an image including a board image, the board image indicating a shape and an arrangement of a component on the board, a position input unit through which an arrangement position of the support pin is input, a display processing unit which causes the display unit to display a figure to be superimposed on the board image, the figure corresponding to the support pin of which the arrangement position is input, a storage unit which stores three-dimensional shape data of an electronic component and three-dimensional shape data of the support pin, an interference judging unit which judges whether or not one or some of the support pins of which arrangement positions input interfere an already mounted component, and an alarm unit which announces occurrence of interference if the interference judging unit judges the occurrence of interference.

A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.

A method for assembling a camera suitable for use for a vision system of a vehicle includes providing a circuit board having first and second sides separated by a thickness dimension of the circuit board. An imager is disposed at the first side of the circuit board and solder pads are disposed at the second side of the circuit board. The solder pads are in electrical connection with circuitry of the circuit board. A coaxial connector is aligned at the solder pads at the second side of the circuit board. The coaxial connector is soldered at the second side of the circuit board via the solder pads. The solder pads may include a plurality of outer solder pads and at least one inner solder pad for connecting to respective contact portions of the coaxial connector.

An electronic component mounting machine includes an image-capturing device and a control device. The image-capturing device captures the images of sub-fiducial marks and main fiducial marks. When the control device can read the main fiducial marks from the images captured by the image-capturing device, the control device determines the mounting positions of the electronic components with respect to a substrate with reference to the main fiducial marks. On the other hand, when the main fiducial marks cannot be read from the images due to a print defect of the main fiducial marks, the control device determines the mounting positions of the electronic components with respect to the substrate with reference to the sub-fiducial marks which are the reference sources of the image-capturing positions of the main fiducial marks.

A method for transporting and installing an electronic device having at least one first electrical contact element includes fixing the electronic device in a recess or interior of a reusable transport and assembly module such that access to the at least one first contact element is blocked by a protective element, transporting the transport and assembly module and the electronic device into a connection region of an electrical apparatus, removing the protective element so that the at least one first contact element is accessible, actuating an actuation apparatus provided on the transport and assembly module to move the electronic device in a direction out of the recess or interior into a contact position in which the at least one first contact element is brought into electrical contact with at least one second contact element provided on the electrical apparatus, and removing the transport and assembly module.