The instant disclosure provides a thin film capacitor and a method of manufacturing the same. The method includes the following steps: placing a carrier substrate on a processing machine including at least one processing unit, and the at least one processing unit having a metal-layer forming module and an insulation-layer forming module that are arranged along a planar production line; forming a plurality of metal layers by the metal-layer forming module of the at least one processing unit, forming a plurality of insulation layers by the insulation-layer forming module of the at least one processing unit, and the metal layers and the insulation layers being alternately stacked on the carrier substrate to form a multilayer stacked structure; and then forming two terminal electrode structures to respectively enclose two opposite side end portions of the multilayer stacked structure.

A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

Provided is a method for manufacturing a gas sensor capable of securing airtightness without a chip in a sensor element. The method includes a step of obtaining an assembled body constituting the gas sensor, including steps of: causing one end of the sensor element to abut to a positioning member for positioning the sensor element; applying a force F1 to the annularly-mounted members including a powder compact annularly mounted to the sensor element under a state that the sensor element is positioned and thereby compressing the powder compact so as to fix the sensor element inside of the tubular body, applying a force F2 larger than the force F1 to the annularly-mounted members under a state that the sensor element is not positioned and thereby further compressing the powder compact, so as to hermetically seal inside of the tubular body.

There is provided a system 10 including at least one of inspection machines 20 and 22 and an NG board discharge machine 24 which moves an NG board to a checking position visible to a worker. The system 10 acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position. In this manner, it is not necessary to arrange the checking-purpose working machine adjacent of a downstream side of the inspection machines, and it is possible to arrange another working machine between the checking-purpose working machine and the inspection machine. In addition, even when the multiple inspection machines are arranged in the system, one checking-purpose working machine can correspond to the multiple inspection machines.

A method for manufacturing and turning a near field communication antenna is provided. A method for manufacturing and tuning a near field communication antenna comprising loading one or more ferrite substrates onto a workstation, loading an antenna biscuit onto the workstation, the antenna biscuit comprising one or more interconnected antennas, stamping the antenna biscuit to form one or more individual antennas, applying the one or more individual antennas to the one or more ferrite substrates to form one or more antenna assemblies, and adjusting placement of the one or more individual antennas relative to the ferrite substrates to adjust functional properties of the one or more antenna assemblies.

A method for manufacturing and turning a near field communication antenna is provided. A method for manufacturing and tuning a near field communication antenna comprising loading one or more ferrite substrates onto a workstation, loading an antenna biscuit onto the workstation, the antenna biscuit comprising one or more interconnected antennas, stamping the antenna biscuit to form one or more individual antennas, applying the one or more individual antennas to the one or more ferrite substrates to form one or more antenna assemblies, and adjusting placement of the one or more individual antennas relative to the ferrite substrates to adjust functional properties of the one or more antenna assemblies.

A substrate working system includes a component mounter that mounts a component on a substrate, and an inspection unit provided in the component mounter or a device downstream of the component mounter and that performs a substrate inspection different from a normal substrate inspection when an abnormality related to a mounting operation is detected in the component mounter.

A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.

When a workpiece holder holding a workpiece is rocked around a lateral rocking axis by a work stage of a mounter and the workpiece is positioned so that one mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the one mounting surface by a mounting head of the mounter. When a posture of the workpiece in the workpiece holder is changed by a posture changing head of a posture changer and thereafter the workpiece holder in which the posture of the workpiece is changed is rocked around the lateral rocking axis by the work stage of the mounter and the workpiece is positioned so that the other mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the other mounting surface by the mounting head of the mounter.

A system including at least one inspection machine and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.