Method for decreasing the number of assembly workstations, comprising: providing a first workstation at a first location, supplied with power from a first source; providing a product to the first workstation and supplying the product with power from the first source; providing a second workstation at a second location, supplied with power from a second source; transporting the product from the first workstation to the second workstation including disconnecting the first source from the product; connecting the product to the second power supply at the second workstation and, before supplying the product with power from the first source, placing the product in a device capable of supplying the product with battery power; disconnecting the first source from the device; and supplying the product with battery power, so that the product remains supplied with power between disconnecting the first source and connecting the product to the second source.

An electronic device manufacturing system may include a mainframe to which one or more process chambers of different size may be coupled. A different number of process chambers may be coupled to each facet (i.e., side wall) of the mainframe. The process chambers coupled to one facet may be of a different size than process chambers coupled to other facets. For example, one process chamber of a first size may be coupled to a first facet, two process chambers each of a second size different than the first size may be coupled to a second facet, and three process chambers each of a third size different than the first and second sizes may be coupled to a third facet. Other configurations are possible. The mainframe may have a square or rectangular shape. Methods of assembling an electronic device manufacturing system are also provided, as are other aspects.

A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.

A method for manufacturing and turning a near field communication antenna is provided. A method for manufacturing and tuning a near field communication antenna comprising loading one or more ferrite substrates onto a workstation, loading an antenna biscuit onto the workstation, the antenna biscuit comprising one or more interconnected antennas, stamping the antenna biscuit to form one or more individual antennas, applying the one or more individual antennas to the one or more ferrite substrates to form one or more antenna assemblies, and adjusting placement of the one or more individual antennas relative to the ferrite substrates to adjust functional properties of the one or more antenna assemblies.

An electronic component mounting method for two types of boards, using an electronic component mounting system in which multiple mounters are arranged in series; the mounters include a board conveyance device having a first conveyance lane that loads the first board and a second conveyance lane that loads the second board, and a component transfer device having a first mounting head and a second mounting head; a portion of multiple mounters are set as independent production mounters and the remaining portion are set as second lane dedicated mounters; mounting a first set of electronic components on the first board is allocated to the first mounting heads of the independent production mounters; and mounting a second set of electronic components on the second board is allocated to the second mounting heads of the independent production mounters and to the first mounting heads and the second mounting heads of the second lane dedicated mounters.

A method for manufacturing and turning a near field communication antenna is provided. A method for manufacturing and tuning a near field communication antenna comprising loading one or more ferrite substrates onto a workstation, loading an antenna biscuit onto the workstation, the antenna biscuit comprising one or more interconnected antennas, stamping the antenna biscuit to form one or more individual antennas, applying the one or more individual antennas to the one or more ferrite substrates to form one or more antenna assemblies, and adjusting placement of the one or more individual antennas relative to the ferrite substrates to adjust functional properties of the one or more antenna assemblies.

A radio frequency identification system, and method of operation thereof, provides: a sensor for sensing the absence or presence of a radio frequency identification transponder at the radio frequency identification system; a supply system connected to the sensor for supplying the radio frequency identification transponder to the radio frequency identification system in the absence of the radio frequency identification transponder at the radio frequency identification system; and a programmer connected to the sensor for writing transponder content to the radio frequency identification transponder at the radio frequency identification system in the presence of the radio frequency identification transponder at the radio frequency identification system.

An electronic device manufacturing system includes a mainframe including a transfer chamber and facets defining side walls of the transfer chamber. The facets include first facet, second facet, third facet, and fourth facet that form the transfer chamber. The first facet has a first number of substrate access ports. The second facet has a second number of substrate access ports. A first substrate access port of the first facet has a first side dimension and a second substrate access port of the second facet has a second side dimension that is different from the first side dimension. The second facet is adjacent to the first facet. The third facet is adjacent to the second facet. The fourth facet has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.

With multiple-board substrate defined as a circuit substrate provided with multiple boards of circuit pattern on which multiple electronic components are mounted, when performing mounting work of multiple electronic components on a multiple-board substrate using three mounters lined up in a row, electronic component mounting work procedures are set such that mounting work of electronic components for each of multiple circuit patterns is performed by all three mounters. Work procedures for mounting work of electronic components surrounded by the dashed lines are set to a first mounter, work procedures for mounting work of electronic components surrounded by the single-dashed solid lines are set to a second mounter, and work procedures for mounting work of electronic components surrounded by the double-dashed solid lines are set to a third mounter.