In a component mounter, a gap between adjacent circular plate sections of nozzles is large enough such that a pressing roller is able to pass through in a vertical direction. Therefore, the size of a circular plate section can be made relatively small, and a rotary head can be made small. A horizontal protrusion overlaps with one or both of adjacent ring-shaped protrusions of the nozzle when viewed from above in a case in which the pressing roller is positioned between adjacent circular plate sections of nozzles. In a state with the pressing roller positioned above the gap between adjacent circular plate sections of nozzles, even if power to a Z-axis linear actuator is cut such that the raising and lowering member suddenly loses support and falls, the horizontal protrusion of the raising and lowering member engages with and stops the ring-shaped protrusion of the nozzle.

An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

In a rotary head type component mounter, before using two suction nozzles of rotary head to pick up the leading components in component supply tape set in two tape feeders, rotary head is moved in the XY directions by head moving mechanism and rotated by head rotating mechanism such that the pickup points of the two suction nozzles are positioned on two straight lines and extending in the tape feeding direction of each tape feeder passing through the ideal pickup points of the leading components of the two tape feeders, and the leading components are fed to component pickup positions and that are the pickup points of the suction nozzles on the two straight lines. Then, the two suction nozzles of rotary head are lowered simultaneously to pick up the two component simultaneously using the two suction nozzles.

The present invention provides a system for transferring a micro LED, the system transferring more efficiently a micro LED dropped in a solution.

A component mounting device that mounts on a board a fitting component to be attached by a mechanical fitting or engagement to a to-be-attached part formed in the board. The component mounting device includes a mounting head which carries out a moving and mounting operation in which the fitting component is taken out from a component supply part by sucking and holding the fitting component, moved and mounted on the to-be-attached part, and pressed by a first load, and a pressing operation in which the fitting component is pressed by a second load larger than the first load, and a head control part which controls the mounting head to suck and hold a neighborhood of a central portion of an upper surface of the fitting component in the moving and mounting operation, and to press a press part corresponding to the to-be-attached part in the pressing operation.

A component mounting machine includes multiple component supplying devices, a head, a head moving device, and a nozzle lifting and lowering device. The component supplying device feeds out a component to a component supply position. The head includes multiple nozzles configured to suction a component. The head moving device moves the head to cause the nozzles to face the respective component supply positions with two or more thereof. The nozzle lifting and lowering device lifts and lowers the nozzle located to face the component supply positions. In positioning the nozzles to face the respective component supply positions, the head is moved so as to prioritize a positional correction of a nozzle facing a smallest sized component over positional corrections of the other nozzles, and in this state, the nozzles facing the respective component supply positions are lifted and lowered simultaneously to suction corresponding components.

A component mounting machine includes a feeder device that has a tape feeding mechanism that feeds out a carrier tape that stores components in respective component storage sections, and a tape peeling mechanism that has a tape peeling blade that carries out peeling, and a component transfer device that has a mounting head that holds a suction nozzle, and a head driving mechanism, the component mounting machine further provided with a peeling start determination section of determining whether or not the peeling starts before the suction nozzle starts a suction operation, and a recovery function section of carrying out a recovery operation in which the recovery function section returns the leading end of the carrier tape temporarily to the front of the tape peeling blade and feeds out the carrier tape again in a case where it is determined that peeling is not started.

An electronic component mounting apparatus includes: a mounting head including a holder for extracting an electronic component and mounting the electronic component onto a substrate, the mounting head being movable in a horizontal direction; an imaging camera disposed on the mounting head for imaging a component extraction position, when the holder is at the component extraction position; a recognition unit for recognizing, based on an image captured by the imaging camera, a positional deviation between the component extraction position and a position of a housing portion where a component is stored in a component feeding unit or a position of the component in the housing portion; and a controller for correcting the component extraction position to a position shifted by a positional deviation recognized by the recognition unit before the component feeding unit extracts a subsequent component, and causing the mounting head to move to the corrected position.

A component mounting device mounts an electronic component on a printed circuit board, and includes a sideview camera which takes an image of a side surface of a target, a mounting head having a nozzle shaft, and a driving device which moves the mounting head to a planar direction on a base. The nozzle shaft includes a shaft main body movably supported to a vertical direction with respect to the mounting head, and a suction nozzle attached at a tip of the shaft main body to suction and hold the electronic component, and an identification mark which identifies the suction nozzle is provided on a side surface of the suction nozzle.

An object of the present disclosure is to provide a component crimping device and a component crimping method that make it possible to improve accuracy of attaching a component onto a substrate by preventing the component from being excessively elongated due to rapid thermal expansion when the component is pressed against the substrate. A lower surface side of a substrate-side terminal part of a substrate held by a substrate holding table is supported by a support, a component placed on a placing table is picked up by a crimping head while heating the component, the component is compressed against a compressing table so as to be elongated, and then the component is pressed against the substrate-side terminal part.