An apparatus for installing and removing glass panels and methods of using the apparatus includes a base portion, a back support structure secured to the base portion, and a glass adjustment system moveably coupled to the back support structure. The glass adjustment system couples to the glass panels. The apparatus is used to install and remove glass panels from, for example, ice rink boards.

A support pin arrangement determination assisting method includes displaying an image including a board image that indicates a shape and an arrangement of an already mounted component on the already mounted surface; inputting an arrangement position of the support pin to the displayed image; and displaying a composite image in which a pin arrangement image indicating the input arrangement position is superimposed on the board image. A planar image of the support pin in the pin arrangement image includes an image of a top portion of a shaft and an image of a contact portion which is located on a tip side of the top portion, which has a sectional shape smaller than that of the top portion, and which contacts and supports a lower surface of the board.

A component mounting apparatus includes a nozzle that sucks a component supplied from a feeder, conveys the component to a predetermined position on a substrate, and mounts the component in the predetermined position. The component mounting apparatus controls an XY-robot to perform repeatedly the component mounting operation while performing a thermal correction from a start of the component mounting operation as a result of a power supply being turned on until an amount of positional deviation due to heat from the XY-robot reaches a steady state. After the steady state is achieved, the component mounting apparatus controls the XY-robot to perform repeatedly the component mounting operation while performing a steady state correction using a correction amount resulting immediately after the steady state is achieved without performing the thermal correction and controls the XY-robot to perform a dummy operation for maintaining the steady state during a standby period.

There is provided technology which is a component mounting machine which mounts electronic components onto a circuit substrate and is capable of displaying a movable region of an inner portion of the component mounting machine within a same image. The component mounting machine is provided with a fixed camera which monitors the inner portion of the component mounting machine and a display section which is capable of displaying a captured image of the fixed camera. The fixed camera is capable of imaging a range from a pickup position at which the suction nozzle picks up the electronic component which is supplied from the component feeder to a mounting position at which the electronic component is mounted onto the circuit substrate within the same image.

A substrate working system includes a component mounter that mounts a component on a substrate, and an inspection unit provided in the component mounter or a device downstream of the component mounter and that performs a substrate inspection different from a normal substrate inspection when an abnormality related to a mounting operation is detected in the component mounter.

An apparatus for installing and removing glass panels and methods of using the apparatus are disclosed. The apparatus includes a base portion, a back support structure secured to the base portion, and a glass adjustment system moveably coupled to the back support structure. Methods for using the apparatus to install and remove glass panels from, for example, ice rink boards, are also disclosed.

A filter removal method for removing a filter held in a filter holding space provided in a tip part of a nozzle shaft in a component suction head, in which a suction nozzle is detachably attached to the tip part of the nozzle shaft, from the component suction head. The method comprises a deforming step of compressing and deforming the filter in the filter holding space, and a discharging step of discharging the compressed and deformed filter from the filter holding space.

A support pin arrangement determination assisting method includes: displaying an image including a board image that indicates a shape and an arrangement of an already mounted component on an already mounted surface; inputting an arrangement position of a support pin to the displayed image; superimposing a pin arrangement image indicating the input arrangement position on the board image to create a composite image; and displaying the composite image. The composite image, a first pin arrangement image, and a second pin arrangement image are superimposed on the board image. The first pin arrangement image is generated by inputting an arrangement position in a state that the board is positioned at the first mounting work position, and the second pin arrangement image is generated on the basis of the first pin arrangement image with an assumption that the board is positioned at the second mounting work position.

A distorted substrate is positioned in a predetermined position and corrected, thereby improving the substrate transfer efficiency. A transport unit capable of transporting and positioning a substrate includes a transport mechanism for transporting the substrate to an unloading position, and a positioning mechanism for positioning the substrate in the unloading position. The positioning mechanism includes a regulating member including at least two pairs of regulating portions capable of abutting against the opposing end faces of the substrate, an abutment moving mechanism for moving one regulating portion toward the other regulating portion in each of the at least two pairs of regulating portions, and a regulation moving mechanism capable of moving the regulating member in a direction in which the substrate is pressed.

An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.