Systems and methods for identifying defective individual packaged modules are presented. A Printed Circuit Board (PCB) having a set of individual module substrates can be received. Further, capturing an image of the PCB and loading a PCB recipe associated with the PCB can be performed. The image of the PCB can be captured by an image capture module that can include one or more cameras. For each individual module substrate, a portion of the image corresponding to the individual module substrate can be compared to the PCB recipe. In addition, it can be determined based on the comparison whether the individual module substrate matches the PCB recipe within a degree of tolerance. In response to determining that the individual module substrate does not match the PCB recipe within the degree of tolerance, a location of the individual module substrate within a map of the PCB can be stored.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

A cable preparation machine includes a frame forming a cable cutting zone and having a cable opening along a cable axis at the cable cutting zone receiving an end of a cable. The cable preparation machine includes a pulley assembly rotatably coupled to the frame about the cable axis, a drive assembly operably coupled to the pulley assembly to rotate the pulley assembly about the cable axis, and a blade assembly operably coupled to the pulley assembly and rotated with the pulley assembly about the cable axis. The blade assembly is configured for cutting an insulator from the end of the cable in a first cutting configuration when the cable is positioned in the cable opening and the blade assembly is configured for cutting a cable braid from the end of the cable in a second cutting configuration when the cable is positioned in the cable opening.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

An electrical conductor aligning device that can, without mutual interference, easily, and in a short period of time, align a plurality of electrical conductors in an annular shape while overlapping in the peripheral direction. The coil element aligning device includes: holding sections, a slide mechanism and a cylinder mechanism. One leg of each coil element is held by the plurality of holding sections, the plurality of coil elements being aligned in an annular shape at a spacing such that there is no overlapping in the peripheral direction, and then the plurality of holding sections being moved inwards in the radial direction by the slide mechanism and the cylinder mechanism, thereby aligning the plurality of coil elements in an annular shape while overlapping in the peripheral direction.

A fabrication apparatus for the fabrication or prefabricationpreferably in an automated or semi-automated mannerof individual wire sections, comprising at least one arrangement apparatus for receiving and arranging a plurality of individual wire sections, in particular prepared wire sections from the fabrication apparatus, wherein the at least one arrangement apparatus comprises a main body and an arrangement section for receiving the wire sections, wherein the arrangement section is designed to string a plurality of individual wire sections through a gap that extends along the base body and along said gap, wherein the at least one arrangement apparatus can be attached to the fabrication apparatus in a releasable manner.

A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.

A batching system for producing special cables includes a motor, a loading plate, wire pulling rollers, a transmission steel pipe and a batching motor; the transmission steel pipe is rotatably connected to an upper end surface of the loading plate by a bracket; the motor is fixedly arranged on a side wall of a mounting bracket; the wire pulling rollers are rotatably connected to an upper end surface of the loading plate; the system further includes: a wiring mechanism, a replacing mechanism and a driving mechanism; the wiring mechanism is coaxially and fixedly connected with an outer end surface of the transmission steel pipe; the replacing mechanism is sleeved on the outer end surface of the transmission steel pipe; the driving mechanism is fixedly mounted on a lower end surface of the loading plate; a winding mechanism for winding wires is coaxially and fixedly arranged on the transmission steel pipe.

Cross-web for use in cable manufacture having a tape-like appearance in their relaxed state and their method of manufacture.

The present invention discloses a wire-selecting device, which comprising a visual discriminating system, a wire-selecting module, and a core positioning seat to be processed. The visual discriminating system comprises an image capturing module and a discriminating module, and judges the appearance of the wire obtained by the module according to the image capturing module And the wire-selecting module includes a plurality of wire-selecting clamps for holding the wires, the sub-clamp group receives the wire-selecting control information from the visual discrimination system; the processing core positioning seat includes A plurality of wire-selecting positioning blocks for holding a plurality of wires, wherein the sub-threading clamps hold a plurality of sub-wire clips correspondingly according to the wire-selecting control information, and after the completion of the wire-selecting operation, The wire is moved to the to-be-processed core positioning seat for subsequent processing.