Provided are an insertion method and an insertion apparatus for efficiently and reliably inserting a plurality of coil elements aligned in a ring shape into respective slots of a stator core. In an insertion method of inserting, the insertion method includes a coil element alignment process S3 of forming an assembly body 50 by assembling the plurality of coil elements 40 in a ring shape in the state where the turn portions 42 alternately overlap each other, a supporting process S42 of supporting the assembly body 50 by using the turn portions 42, and an insertion process S45 of allowing the assembly body 50 and the stator core 60 to be close to each other and inserting the leg portions 41 of the coil elements 40 of the assembly body 50 into the slots 61.

An electrical conductor aligning device that can, without mutual interference, easily, and in a short period of time, align a plurality of electrical conductors in an annular shape while overlapping in the peripheral direction. The coil element aligning device includes: holding sections, a slide mechanism and a cylinder mechanism. One leg of each coil element is held by the plurality of holding sections, the plurality of coil elements being aligned in an annular shape at a spacing such that there is no overlapping in the peripheral direction, and then the plurality of holding sections being moved inwards in the radial direction by the slide mechanism and the cylinder mechanism, thereby aligning the plurality of coil elements in an annular shape while overlapping in the peripheral direction.

A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.

Provided are an insertion method and an insertion apparatus for efficiently and reliably inserting a plurality of coil elements aligned in a ring shape into respective slots of a stator core. In an insertion method of inserting, the insertion method includes a coil element alignment process S3 of forming an assembly body 50 by assembling the plurality of coil elements 40 in a ring shape in the state where the turn portions 42 alternately overlap each other, a supporting process S42 of supporting the assembly body 50 by using the turn portions 42, and an insertion process S45 of allowing the assembly body 50 and the stator core 60 to be close to each other and inserting the leg portions 41 of the coil elements 40 of the assembly body 50 into the slots 61.

A driving board folding machine comprises a machine housing, a movable table and one or more pre-folding stations for holding an unfolded flexible circuit and a circuit housing. When the driving board folding machine is activated, the one or more pre-folding stations are moved to a folding station located within the machine housing and the flexible circuit is folded and inserted within the circuit housing. The driving board folding station is able to comprise multiple pre-folding stations on one or more sides of the movable table. A holding pin holds the flexible circuit in place while a forming press moves in order to preform the flexible circuit, fold the flexible circuit and move the circuit housing to insert the flexible circuit into the housing.

A solar cell interconnect processing assembly includes a stack of interconnects, a positioning head, and a control system. The positioning head picks up an interconnect from the stack of interconnects at a first location, moves the interconnect from the first location to a second location, heats the interconnect while moving the interconnect from the first location to the second location, and places the interconnect over two adjacent solar cells at the second location. The control system controls a temperature at which the interconnect is heated and controls movement of the positioning head.

Systems and methods for identifying potentially defective individual packaged modules are presented. A printed circuit board (PCB) having individual module substrates can be received. An image of the PCB is captured and a PCB recipe associated with the PCB is loaded. For each individual module substrate, a portion of the image corresponding to the individual module substrate is compared to the PCB recipe. It can be determined based on the comparison whether the individual module substrate matches the PCB recipe within a degree of tolerance. When an individual module substrate does not match the PCB recipe within the degree of tolerance, a location of the individual module substrate within a map of the PCB can be stored.

In various embodiments, a tabbing ribbon for connecting at least one solar cell is provided, wherein the tabbing ribbon at least partially extends in a non-planar manner and includes a non-planar section.

A method and an apparatus for connecting a coaxial (or a micro coaxial) cable to the bottom side of a printed circuit board (PCB) in order to improve signal integrity of a test circuit. A coaxial or a micro coaxial cable is directly connected to a coaxial cable to the bottom sides of pads located on an exterior later of the PCB.

A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.