Y10T83/0341

PROCESS OF PRODUCING A COMPONENT AND APPARATUS THAT PRODUCES A COMPONENT
20180220535 · 2018-08-02 ·

A process of producing a component includes providing a substrate having an electrically conductive surface in the form of an electrically conductive layer; subdividing the layer with the aid of a scratching process into a first electrically autonomous region and a second electrically autonomous region, wherein an electrically insulating region is formed in the electrically conductive layer to electrically separate the electrically autonomous regions; forming an electrical potential difference between the first electrically autonomous region and the second electrically autonomous region; and applying an electrically charged substance or an electrically charged substance mixture onto the first electrically autonomous region and/or the second electrically autonomous region, wherein the electrically autonomous region and/or an amount of the applied electrically charged substance or of the electrically charged substance mixture are adjusted by the electrical potential difference.

Negative pressure wound treatment apparatus
12121417 · 2024-10-22 · ·

A wound packing material is provided, suitable for use in negative pressure wound therapy, including a body of a porous material, the body including frangible regions defining a plurality of portions, the frangible regions allowing the portions to be selectively removed from the body. Methods of manufacturing the wound packing material, and methods of its use are also provided.

LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Sheet glass, method for manufacturing sheet glass, and device for manufacturing sheet glass

A method of manufacturing a glass sheet involves forming a scribe in one surface of a glass sheet having a rectangular shape on a periphery of an edge portion of the glass sheet in parallel to the edge portion, and cutting the glass sheet along the scribe as a boundary. The method includes forming the scribe in a region other than both end portions of the glass sheet in a direction along the edge portion; and cutting the glass sheet along a bending portion in which the glass sheet is locally bent, the bending portion being continuously formed in a state of being connected to the scribe and gradually protruding from an edge portion side to an inner side as being shifted away from the scribe.

Method of Producing a Liquid Cooled Coldplate

A liquid cooled coldplate has a tub with an inlet port and an outlet port and a plurality of pockets recessed within a top surface of the tub. Each pocket has a peripheral opening and a ledge, the ledge disposed inwardly and downwardly from the peripheral opening. The inlet port and outlet port are in fluid communication with the pocket via an inlet slot and an outlet slot. A plurality of cooling plates are each received by a pocket and recessed within the pocket. Each cooling plate comprises an electronics side for receiving electronics and enhanced side for cooling the cooling plate. The enhanced side of the cooling plate comprises a plurality of pins formed by micro deformation technology. The tub may be formed by extrusion.

Optical fiber scribing tool

A portable, hand tool for scribing optical fibers in a cleaving process. The scribing tool comprises a body within which the optical fiber is supported for rotation with respect to the body, about an axis within the body. The optical fiber is constrained by supports from movements along its axis. An actuator moves a scribing bit orthogonal relative to the fiber axis. The actuator may be a piezoelectric actuator, such as in a tube that bends under applied voltage. In one embodiment the scribing tool has a single scribing bit. In another embodiment, the scribing tool has multiple (N) scribing bits that can be applied against the optical fiber simultaneously.

Compound Barb Medical Device and Method

A compound barb medical device is provided which includes an elongated body having at least one barb formed along the length of the body, the barb defining an inner surface with a first portion disposed at a first orientation relative to a longitudinal axis of the elongated body, and a second portion disposed at a second orientation relative to the longitudinal axis. Optionally, the barb defines a third portion disposed at a third orientation relative to the longitudinal axis. A method for forming a compound barb on a medical device is also provided.

Compound barb medical device and method

A compound barb medical device is provided which includes an elongated body having at least one barb formed along the length of the body, the barb defining an inner surface with a first portion disposed at a first orientation relative to a longitudinal axis of the elongated body, and a second portion disposed at a second orientation relative to the longitudinal axis. Optionally, the barb defines a third portion disposed at a third orientation relative to the longitudinal axis. A method for forming a compound barb on a medical device is also provided.

Microscopic geometry cutting device and microscopic geometry cutting method

A microscopic geometry cutting device includes: a controller that outputs a timer count start command in starting a driving program which controls a drive of an X-axis or a Y-axis moving mechanism; an arrival time calculator that calculates an arrival time from when the timer count start command is output till when the cutter arrives at a machining start position in accordance with relative moving speed information of the moving mechanisms and machining start position information of a workpiece W; an elapsed time determiner that determines whether an elapsed time from when the timer count start command is output is coincident with the arrival time and outputs a trigger signal when the elapsed time is coincident with the arrival time; and a reciprocating stage driver that drives the reciprocating stage in a manner that the cutter advances and retracts in a predetermined cutting depth in response to the trigger signal.

Method of producing electronics substrate with enhanced direct bonded metal
09655294 · 2017-05-16 · ·

A substrate for electronic components is formed by bonding a cooling metal layer to one side of a ceramic tile and bonding an electronic metal layer to the other side of the electronic tile. The substrate is secured to a machining base and the cooling metal layer surface is enhanced through an MDT process. In the process, fins are sliced into the cooling metal layer with a tool to a depth of less than the cooling metal layer thickness. The slicing forces material upward without removing material from the cooling metal layer, forming fins that extend beyond the original thickness of the cooling metal layer. The fins can be cross-sliced at an angle to form pins.