Patent classifications
Y
Y10
Y10T
83/00
Y10T83/04
Y10T83/0405
Y10T83/041
Y10T83/041
Apparatus and Process for Cutting Adhesive Labels
A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.