A fireshield fastener hood and method of bonding a cover to a substrate therefor.

A method and apparatus for forming a bend in composite panel. A method for forming a bend in a composite panel comprises forming a slot having a curved flange in the composite panel, inserting a sheet into the curved flange, and bending the composite panel with the slot and the sheet within the curved flange about a longitudinal axis of the slot to form the bend.

A device for welding profiled elements in plastic material includes: a base frame supporting retaining members of respective profiled elements, to engage the profiled elements with corresponding zones to be welded facing one another; a heater for heating the weld zones of the profiled elements; a unit to move the retaining members, to shift the profiled elements between a first reciprocal away direction and a second reciprocal closer direction wherein the zones to be welded are coupled together; and a removal unit utilizing milling The removal unit includes: a supporting frame positioned in correspondence to the retaining members; at least one machining tool; a motor part associated with the tool; and a movement member of the tool, to move it between a first idle condition and a second working condition wherein it is placed between the profiled elements.

A method for welding profiled elements in plastic material includes: preparing two profiled elements, arranged with respective weld zones facing one another; making a groove corresponding to at least one weld zone of the profiled elements, the grooving performed by a removal operation on a peripheral edge of at least one profiled element; heating the weld zones; coupling the zones to be welded to one another, pressing the profiled elements together to keep the zones to be welded in reciprocal contact. The coupling step includes: a sub-step of melting the zones to be welded into one another in order to define a welding bead; a sub-step of making a containing compartment defined by the groove, the welding bead being made internally of the containing compartment; and the step of arranging a containing presser in correspondence to the containing compartment for preventing exit of the welding bead from the compartment itself.

A package assembly including a first layer having a bottom surface and a top surface, and at least two panels coupled to the top surface of the first layer such that a first panel is disposed along a right edge of the first layer and the second panel is disposed along a left edge of the first layer, the first panel being pivotally engaged to the second panel along an axis, the at least two panels having formed therein a recess.

A flexible substrate, a display device and a method for bonding an electronic device onto a flexible substrate are disclosed. The flexible substrate includes a base substrate, the base substrate includes a bonding portion for bonding an electronic device and an auxiliary bonding portion integrally formed with the bonding portion, the auxiliary bonding portion and the bonding portion are disposed back to back, and the bonding portion completely falls into a region where the auxiliary bonding portion is provided in an orthographic projection direction. With an auxiliary bonding portion being disposed beside the bonding portion for bonding the electronic devices such as ICs and FPCs, when bonding the electronic device onto the bonding portion, the auxiliary bonding portion can enhance the strength of the bonding portion and improve the bonding alignment precision and contact property of the electronic device, which further improves the non-defect ratio of the flexible display device and has a lower cost.

The described embodiments relate to a method for embedding one or more electrical components in a flexible substrate. The method includes receiving a substrate of a flexible material, wherein the substrate includes a cosmetic surface and an opposing surface. The method further includes applying a carrier form to the substrate to create a carrier assembly, wherein the carrier form includes one or more positive images representative a design to be transferred to the opposing surface of the substrate. The method further includes removing or cutting a portion of material from the opposing surface of the substrate to form a new opposing surface. Subsequently, the carrier form is removed from the substrate to reveal one or more embedding cavities extending into the substrate at the new opposing surface. In some embodiments, the embedding cavities can thereafter receive one or more electrical components.

An apparatus for manufacturing absorbent articles includes: a swinging mechanism that feeds an elastic member while swinging the elastic member along a cross direction crossing a conveyance direction of a sheet-shaped continuum constituting an absorbent article, and that disposes a part of the elastic member on the continuum; a guiding member that conveys the elastic member; a cutting mechanism that cuts the elastic member; a joining mechanism that conveys the elastic member and the continuum that are supplied from the guiding mechanism to be taken along an outer periphery of the joining mechanism; and a sheet supply mechanism that supplies a sheet member onto an end portion in the cross direction of the continuum. A tangential direction of a deviation point at which the continuum is spaced from the guiding mechanism and a tangential direction of an arrival point at which the continuum reaches the joining mechanism are coincident with each other.

A light assembly includes an electroluminescent cable, an elongated lens, and a substantially planar substrate. The electroluminescent cable has an outer surface extending along a longitudinal dimension of the electroluminescent cable. The elongated lens extends along the longitudinal dimension of the electroluminescent cable and encloses at least a portion of the outer surface of the electroluminescent cable. The elongated lens is adapted to refract light emitted from the electroluminescent cable. The elongated lens structure is adhered to the substantially planar substrate. In certain instances, the substrate is a reflective substrate adapted to reflect light emitted from the electroluminescent cable.

Stents and methods of manufacturing a stents with enhanced fracture toughness are disclosed.