A method of joining substrate portions includes positioning the substrate portions such that the substrate portions overlap at an overlap area. The substrate portions each have a melting temperature and an outer surface. A fluid is heated to a temperature sufficient to at least partially melt the substrate portions. A jet of the heated fluid is directed from a fluid orifice onto the substrate portions at the overlap area. The heated fluid penetrates at least one of the outer surfaces of the substrate portions. The substrate portions are at least partially melted using the heated fluid. The substrate portions are compressed using a pressure applying surface adjacent the fluid orifice to join the substrate portions together at the overlap area.

In the present invention, one surface of a belt-shaped sheet laminate (10), in which a plurality of sheets are laminated, is pressed against a support member (21) having a light passage section (27) through which a laser beam (30) can pass, and the belt-shaped sheet laminate (10) is irradiated, from the support member (21) side via the light passage section (27), with a laser beam (30) to cut and fusion-bond the belt-shaped sheet laminate (10), thereby sealed edge sections (4) are formed by fusion-bonding the edge sections of the plurality of sheets.

The present invention discloses an electromagnetic wave shielding film, comprising at least one electromagnetic shielding layer. A printed circuit board comprising the shielding film, is formed by tightly connecting the electromagnetic wave shielding film with the printed circuit board in the direction of thickness, wherein a ground layer is disposed on said printed circuit board. A method for producing the circuit board, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the adhesive film layer by a rough surface of the electromagnetic shielding layer, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the shielding film by an electrically conductive substance, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) forming through holes or blind holes in the circuit board; (3) metallizing the holes, to achieve grounding. The adhesive film layer of the shielding film of the present invention contains no conductive particle, so that the cost and the insertion loss are reduced, and the development demand of high-speed and high-frequency of the electronic products is met.

A method for manufacturing a plurality of filter assemblies is provided that includes providing first and second housing sheets and positioning a filtration medium therebetween. Heat and pressure are applied to form first, second, and peripheral seals of at least two filter assemblies at the same time. Each second seal is positioned outboard of the associated first seal with a non-seal area therebetween, while each peripheral seal is positioned outboard of the associated second seal. The first seal commingles the housing sheets and the filtration medium, while the peripheral seal and the periphery of the second seal commingle only the housing sheets. The peripheral seal may include a tear seal to enable separation of a plurality of adjacent filter assemblies.

A process of manufacturing a roll of plastic bags. The process includes forming a tubular blown film, and collapsing the tubular blown film so that the tubular blown film includes a first side, a second side, a first edge, and a second edge. Openings are cut in the collapsed tubular blown film, and sealing closure mechanisms are inserted through the openings into the collapsed tubular blown film. The sealing closure mechanisms are then fixed to the collapsed tubular blown film.

Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.