Y10T156/109

Partial encapsulation of stents

A method of making an implantable medical device includes extruding a first ePTFE tube and a second ePTFE tube, cutting a plurality of slits in the first ePTFE tube, positioning a radially expandable support layer between the first and second ePTFE tubes so that the slits span portions of the support layer, and laminating the first ePTFE tube to the second ePTFE tube through openings in the support layer.

Repulpable adhesives
09988558 · 2018-06-05 · ·

The invention relates to a repulpable adhesive comprising orthophosphoric acid, to adhesive tapes comprising at least one layer of such an adhesive, and to the use of adhesive tapes of this kind.

Transfer for Application to a Surface
20180117895 · 2018-05-03 ·

A conductive transfer for application to a surface is described. The conductive transfer comprises first and second non-conductive ink layers and an electrically conductive layer positioned between the first and second non-conductive ink layers. The conductive transfer also includes an adhesive layer for adhering the conductive transfer to the surface of an article.

Process for inhibiting galvanic corrosion of an aluminum structure connected, without using a splice plate, to a composite structure having a fiber including graphite

A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.

Hydrophobic surface coating systems and methods for metals
09670060 · 2017-06-06 · ·

This is provided a hydrophobic or superhydrophobic surface configuration and method of forming a hydrophobic or superhydrophobic material on a metallic substrate. The surface configuration comprises a metallic substrate having a carbon nanotube/carbon fibers configuration grown thereon, with the carbon nanotubes/carbon fibers configuration having a heirarchial structure formed to have a predetermined roughness in association with the surface. The method comprises providing a metallic substrate having a predetermined configuration, and growing a plurality of carbon nanotubes/fibers or other nanostructures formed into a predetermined architecture supported on the substrate.

Process for Inhibiting Galvanic Corrosion of an Aluminum Structure Connected, Without Using a Splice Plate, to a Composite Structure Having a Fiber Including Graphite
20170136757 · 2017-05-18 ·

A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.

Apparatus Configured as a Structure Comprising a Skin Including a Bond without a Splice Plate
20170100909 · 2017-04-13 ·

A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.

Method for producing 3-D printed images
09616646 · 2017-04-11 · ·

A method of producing an apparent etched or embossed effect in a print purely by the use of printing and lamination processes, in which a varnish 3 is pressed into to selected areas of a softer coating 2 to produce indentations in the coating layer 2 as during lamination of a printed article comprising a substrate 1 and an optional overlay 4, and a printed article obtainable using the method.

Electro-optic displays, and materials and methods for production thereof

An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.