A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Disclosed is waterproofing sheeting that uses a polyester layer that provides high lateral stability and puncture resistance. The waterproof sheeting can be used in many applications including waterproof roof underlayments, waterproof sheeting for foundations, underlayment for tile and flooring and various other applications. The waterproof sheeting can be manufactured without many of the problems associated with the granular coatings of existing waterproof sheeting that create excessive wear and environmental hazards.

A fiber enforced sheet for use as a wall or floor covering which comprises of adhered thin bricks bonded to a fiber-reinforced, backing layer. Thin brick is adhered to the fiber enforced sheet. The fiber enforced backing increases strength and rigidity to the thin brick during handling, and installation permits the thin bricks to be adhered to proper specification and spacing to be cut using ordinary tile or thin brick tools.

A method for fabricating a heat exchange construct is provided.