A method for separating and recovering a layered film laminated and adhered with a reactive adhesive, the method including a step 1 of immersing the layered film in an alkaline solution while stirring the layered film with heating at 20? C. to 90? C. or ultrasonically vibrating the layered film and a step 2 of recovering separated single-layered films that constitute the respective layers of the layered film. The reactive adhesive is preferably a reactive adhesive containing a polyisocyanate composition and a polyol composition and more preferably a reactive adhesive containing a polyisocyanate composition, a polyol composition, and a compound having an acidic group.

The present invention relates to a method for transferring two-dimensional nanomaterials. The method comprises the following steps: S1, providing a first substrate and a two-dimensional nanomaterial layer on a surface of the first substrate; S2, covering the two-dimensional nanomaterial layer with a carbon nanotube film structure; S3, obtaining a composite structure comprising the two-dimensional nanomaterial layer and the carbon nanotube film structure by removing the first substrate with a corrosion solution; S4, cleaning the composite structure by placing the composite structure on a surface of a cleaning solution; S5, picking up the composite structure from the cleaning solution with a target substrate, by contacting the target substrate with the two-dimensional nanomaterial layer of the composite structure; and S6, removing the carbon nanotube film structure from the composite structure.

A carbon fiber recovery method for recovering carbon fibers from a fiber reinforced plastic member having a carbon fiber reinforced plastic (CFRP) layer on which a glass fiber reinforced plastic (GFRP) layer is formed is provided. This method includes: forming a cut that penetrates through the GFRP layer and reaches the CFRP layer in the fiber reinforced plastic member; causing a heated phosphorus-containing solution to penetrate from the cut and separating the CFRP layer from the GFRP layer in the vicinity of an interface between the CFRP layer and the GFRP layer; and dissolving, by a resin solution, a resin part of the CFRP layer from which the GFRP layer has been removed and then recovering the remaining carbon fibers.

The present invention provides a method of promoting separation of polymer bonded to a substrate of different material, which collectively form at least part of a polymer composite structure, the method comprising: (1) contacting the polymer composite structure with a composition comprising organic solvent which is absorbed within one or both of the polymer and substrate, wherein the composition comprising organic solvent does not dissolve either the polymer or the substrate, and (2) contacting the polymer composite structure provided in step (1) with liquid (i) having a temperature higher than the boiling point of the composition comprising organic solvent used in step (1), and (ii) that does not dissolve either the polymer or the substrate, the action of which promotes separation between the polymer and the substrate.

The present invention discloses a method for removing a screen coating film, which comprises: s1. film cutting: the screen coating film is cut at four sides thereof with a cutter, with the cutting depth being the thickness of the coating film; s2. film soaking: the coating film of the screen is soaked in a solution for 4 to 5 hours; s3. re-cutting: the screen coating film is re-cut with the cutter, with the cutting depth being the thickness of the coating film; s4. film tearing: the cut coating film is torn off from the screen; s5. glue cutting: glue that is not torn off on the surface of the screen is cut off with a special cutter; s6. scrubbing and cleaning: the screen is thoroughly cleaned and scrubbed with a detergent; and s7. suck-drying: the detergent remaining on the screen is suck-dried.

A carbon fiber recovery method for recovering carbon fibers from a fiber reinforced plastic member having a carbon fiber reinforced plastic (CFRP) layer on which a glass fiber reinforced plastic (GFRP) layer is formed is provided. This method includes: forming a cut that penetrates through the GFRP layer and reaches the CFRP layer in the fiber reinforced plastic member; causing a heated phosphorus-containing solution to penetrate from the cut and separating the CFRP layer from the GFRP layer in the vicinity of an interface between the CFRP layer and the GFRP layer; and dissolving, by a resin solution, a resin part of the CFRP layer from which the GFRP layer has been removed and then recovering the remaining carbon fibers.

A flexible display motherboard and a manufacturing method thereof are provided. The flexible display motherboard includes a carrier substrate and a flexible display panel unit formed thereon. The flexible display panel unit includes a flexible base formed on the carrier substrate, and a display region and a periphery region which are positioned on the flexible base. A display device is formed in the display region, and the periphery region surrounds the display region. The flexible display panel unit further includes a dissolvable layer positioned between the carrier substrate and the flexible base. The dissolvable layer is formed at least in an area corresponding to the display region. The dissolvable layer is dissolvable in a solvent.

Methods for separating a plurality of diamagnetic directed self-assembled diamagnetic components are provided. One method includes, for instance: contacting a release substrate to the plurality of diamagnetic components, the plurality of diamagnetic components including a non-diamagnetic component affixed to a diamagnetic portion by a first adhesive, and removing the release substrate, the non-diamagnetic component being affixed to a final substrate by a second adhesive and the release substrate being affixed to the diamagnetic portion by a third adhesive, and wherein the removing removes the diamagnetic portion and at least a portion of the first adhesive from the non-diamagnetic component.

A method for delaminating a graphene layer from a metal catalyst substrate. The method includes depositing the graphene layer on the metal catalyst substrate to form a layered structure and soaking the layered structure in a water-based solution comprising water and a water-miscible organic solvent such that the water-based solution intercalates between the graphene layer and the metal catalyst substrate and oxidizes the metal catalyst substrate for delamination of the graphene layer from the metal catalyst substrate.

The present invention provides a procedure of processing a workpiece such as backside grinding of a device wafer and an apparatus designed for the procedure. The procedure comprises (1) preparing a bonded stack comprising (e.g. consisting of) a carrier layer, a workpiece layer, and an interposer layer therebetween; (2) processing the workpiece layer; and (3) delivering a gas jet at the junction between two adjacent layers in the stack to separate or debond the two adjacent layers. Technical merits of the invention include enhanced efficiency, higher wafer throughput, reduced stress on workpiece surface, and uniformly distributed stress and avoidance of device wafer breakage and internal device damage, among others.