According to various embodiments of the present invention, an electronic device comprises: a heating unit, which includes a lower heating unit and an upper heating unit rotatably coupled to the lower heating unit, and heats an external electronic device mounted on at least one surface of the lower heating unit; a fixing unit, which is disposed to be adjacent to the lower heating unit, and has at least one part formed to be movable in the longitudinal direction of the lower heating unit, thereby fixing the external electronic device; a adsorption unit having one part, which is inserted into at least one recess formed on the upper heating unit, and adsorbing at least a region of the external electronic device; and a driving unit, which is disposed at one side or a surrounding part of the heating unit, can move in the direction perpendicular to the moving direction of the fixing unit, and rotates the upper heating unit by pressurizing the same.

A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.

The present disclosure provides a peeling device and method for film material. The film material includes a first film layer, a second film layer, and a third film layer stacked in sequence, and the first film layer and the second film layer have bodies corresponding to the third film layer and protrusions. The peeling device is configured to peel off the first film layer and includes: an abutment divided into a first area configured to place the bodies of the first film layer and the second film layer and the third film layer, and a second area configured to place the protrusions of the first film layer and the second film layer; and a peeling mechanism configured to be coupled to the protrusion of the first film layer to separate the first film layer from the second film layer.

A transfer apparatus holdes a plate-shaped workpiece under suction in a noncontact condition and transfers the workpiece. The transfer apparatus includes a base, a Bernoulli transfer pad fixed to the base for spraying air toward the workpiece to produce a vacuum, and a moving unit for moving the base. The Bernoulli transfer pad includes a cylindrical pad body. The pad body has a lower surface as a holding surface to which a fluid spraying portion opens and an annular pad mounting portion for mounting an annular pad. When the annular pad is mounted on the annular pad mounting portion, the holding surface is increased in a radial direction of the pad body to thereby increase a suction force for sucking the workpiece.

When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.

A processing apparatus includes a chuck table mechanism including a chuck table configured to hold the wafer and a table base configured to support the chuck table in a detachable manner. The chuck table includes a porous plate having a suction surface that sucks the wafer, a frame body surrounding surfaces of the porous plate other than the suction surface of the porous plate, a wafer suction hole formed in the frame body and configured to transmit a suction force to the suction surface of the porous plate, and a bolt hole formed in the frame body and configured to fix the frame body to the table base.

A dummy removal device includes a picker picking a point of a dummy portion of a preliminary display module and moving in a first moving direction to separate a first portion of the dummy portion from the preliminary display module; and a separator disposed adjacent to the separated first portion and moving in a second moving direction intersecting the first moving direction to remove a second portion of the dummy portion from the preliminary display module, and the dummy portion is disposed around an effective portion of the preliminary display module.

A processing apparatus includes a wafer cassette table, a wafer carrying-out mechanism, a wafer table, a frame housing unit, a frame carrying-out mechanism, a frame table, a tape sticking unit, a tape-attached frame conveying mechanism, a tape pressure bonding unit, a frame unit carrying-out mechanism, a reinforcing part removing unit, a ring-free unit carrying-out mechanism, and a frame cassette table. The wafer carrying-out mechanism includes a Bernoulli chuck mechanism that jets gas to the back surface of the wafer and generates a negative pressure. The gas jetted by the Bernoulli chuck mechanism is inert gas. The wafer carrying-out mechanism jets the inert gas from the Bernoulli chuck mechanism to suppress oxidation of the back surface of the wafer when the wafer is carried out.

A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.

A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.