A method is provided for decomposition of a polymeric article, wherein the polymeric article contains a polymer and one or more energy modulation agents, by applying an applied energy to the polymeric article, wherein the one or more energy modulation agents convert the applied energy into an emitted energy sufficient to cause bond destruction within the polymer.

Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece. Consistent with at least one embodiment, a laser lift off system and method may be used to provide monolithic lift off of one or more epitaxial layers on a substrate of a semiconductor wafer.

A method for attaching and detaching a substrate from a bonded stack is disclosed. A broadband light-absorbing material is combined with an adhesive material to form a broadband light-absorbing adhesive. A layer of the broadband light-absorbing adhesive is then applied on one side of a transparent carrier. A substrate is placed on the broadband light-absorbing adhesive and the transparent carrier to form a bonded stack. The substrate can be a wafer or a polymeric film. At this point, processing steps can be performed on the substrate. After the processing steps have been completed, a light pulse from a flashlamp is utilized to heat up the broadband light-absorbing adhesive in order to loosen the substrate from the bonded stack such that the substrate can be easily detached from the bonded stack.

Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; forming an organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; stress relief etching the second side of the semiconductor substrate; applying a backmetal over the second side of the semiconductor substrate; removing one or more portions of the backmetal through jet ablating the second side of the semiconductor substrate; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.

A method for disassembling a stack of at least three substrates. The invention relates to the techniques for transferring thin films in the microelectronics field. It proposes a method for disassembling a stack of at least three substrates having between them two interfaces, one interface of which has an adhesion energy and an interface of which has an adhesion energy, with less than, the method comprising: 1) implementing a removal of material on the first substrate, in order to expose a surface of the second substrate, 2) transferring the stack onto a flexible adhesive film so that the surface has, with an adhesive layer of the film, an adhesion energy greater than, and 3) disassembling the third substrate at the interface between the second substrate and the third substrate. The method makes it possible to open the stack via the interface thereof with the highest adhesion energy.

According to various embodiments of the present invention, an electronic device comprises: a heating unit, which includes a lower heating unit and an upper heating unit rotatably coupled to the lower heating unit, and heats an external electronic device mounted on at least one surface of the lower heating unit; a fixing unit, which is disposed to be adjacent to the lower heating unit, and has at least one part formed to be movable in the longitudinal direction of the lower heating unit, thereby fixing the external electronic device; a adsorption unit having one part, which is inserted into at least one recess formed on the upper heating unit, and adsorbing at least a region of the external electronic device; and a driving unit, which is disposed at one side or a surrounding part of the heating unit, can move in the direction perpendicular to the moving direction of the fixing unit, and rotates the upper heating unit by pressurizing the same.

Apparatuses and methods adapted for removing a layer of paint, sealant, or adhesive from a surface of an article, including wooden, metal, plaster, stone, and brick articles. The apparatuses are provided with a module comprising at least one carbon infrared emitter bulb that generates short-wavelength infrared radiation. The module has an opening through which the infrared radiation is emitted from the module, and the intensity and wavelengths of the infrared radiation are controlled to selectively attain temperatures in a range of about 90 to 375° C. at the surface of the article when located a distance of about 5 to 15 centimeters from the opening of the module.

A mass transfer apparatus, a mass transfer system, and a control method for mass transfer are provided. The mass transfer apparatus includes a beam emission assembly, a rotating lens, and a rotating lens adjusting assembly. The rotating lens is configured to receive the beam emitted from the beam emission assembly. The rotating lens adjusting assembly is connected with the rotating lens. The rotating lens adjusting assembly is configured to control the rotating lens to perform peripheral rotation. The rotating lens adjusting assembly is also configured to adjust a rotation radius of the rotating lens.

A surface cleaning apparatus uses an inverted cyclone. An air flow path extends from a dirty air inlet to a clean air outlet. A suction motor is positioned in the air flow path. The inverted cyclone is downstream from the dirty air inlet in a first cyclonic cleaning stage. The cyclone defines a cyclone chamber having a lower air inlet, a lower air outlet and an upper dirt outlet. An openable dirt collection chamber is in communication with the upper dirt outlet.

A mass transfer apparatus, a mass transfer system, and a control method for mass transfer are provided. The mass transfer apparatus includes a beam emission assembly, a rotating lens, and a rotating lens adjusting assembly. The rotating lens is configured to receive the beam emitted from the beam emission assembly. The rotating lens adjusting assembly is connected with the rotating lens. The rotating lens adjusting assembly is configured to control the rotating lens to perform peripheral rotation. The rotating lens adjusting assembly is also configured to adjust a rotation radius of the rotating lens.