Methods, systems and devices to divide a layer of a first material from another material, to which is attached, are provided. Particularly, for the separation of the PVC from a modular carpet. By the use of a parallel blades mechanism that through an opposite counterpart apply at least a shear stress over the material of the modular carpet to tear the PVC layer and divide it. The carpet is preheated to facilitate the process of division and reuse of said PVC.

A method of fabricating a device includes providing a process substrate on a carrier substrate, where the process substrate has a rectangular shape with a pair of long sides and a pair of short sides, providing a device on the process substrate, and continuously peeling the process substrate from the carrier substrate along a curve passing through a starting point which is one of vertices the process substrate, where the curve substantially perpendicularly passes through one of the short sides spaced apart from the starting point.

A method and device for detaching a first substrate, which is connected to a second substrate by an interconnect layer, from the second substrate by embrittlement of the interconnect layer. A method for bonding of a first substrate to a second substrate with an interconnect layer which can be embrittled by cooling. A use of a material which can be embrittled for producing an interconnect layer between first and second substrate for forming a substrate stack. A substrate stack, formed from a first substrate, a second substrate and an interconnect layer located therebetween, the interconnect layer formed from a material which can be embrittled. A wafer chuck for holding a first substrate when the first substrate is being detached from a second substrate with fixing means which can be activated by lowering the temperature.

A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

Exfoliation of graphene from graphite using multilayer coextrusion is generally disclosed. In some example embodiments, graphite may be dispersed within a first processing material, and the first processing material and a second processing material may be co-extruded through a plurality of series coupled layer multiplication dies to exfoliate graphene from the graphite. The graphene may be separated from the resulting multi-layered material. In some example embodiments, graphite flake and/or expanded graphite may be dispersed within the first processing material.

Automatic separation of substrates from spacers within a substrate/spacer stack or laminate for use during a hard disk recording media fabrication process. In one example, a delamination apparatus includes a roller or brush configured to rotate while pressing against a flat surface of a substrate at one end of the laminate to peel the substrate from the laminate to expose an adjacent spacer and to then rotate against a flat surface of the spacer to peel the spacer from the laminate to expose another substrate of the laminate. The apparatus also includes a pusher bar configured to push against the opposite end of the laminate to push the laminate against the roller. The pusher bar may be offset from a central longitudinal axis of the laminate. A bath may be provided for submerging the laminate, the pusher, and the roller in a lubricating liquid. Method embodiments are also described.