An apparatus for coating a part that has an asymmetrical edge. The apparatus includes a film dispenser, a film retriever, a mandrel; and a part holder. Preferably one or both of the mandrel and the part holder move in an angular relationship to one another, and the film dispenser and the film retriever move co-operatively in at least two dimensions with respect to the part holder. There is further provided a film having a first edge and a second edge, and the film can be a decorative coating, a protective coating or combinations of these. The film dispenser holds the first edge of the film, the film is positioned between the mandrel and the part holder and the film retriever holds the film second edge.

An apparatus for coating a part that has an asymmetrical edge. The apparatus includes a film dispenser, a film retriever, a mandrel; and a part holder. Preferably one or both of the mandrel and the part holder move in an angular relationship to one another, and the film dispenser and the film retriever move co-operatively in at least two dimensions with respect to the part holder. There is further provided a film having a first edge and a second edge, and the film can be a decorative coating, a protective coating or combinations of these. The film dispenser holds the first edge of the film, the film is positioned between the mandrel and the part holder and the film retriever holds the film second edge.

A method for attaching a fingerprint module which includes providing an adhesive tape which includes a base film, a protective film which is oppositely arranged to the base film, and a number of adhesive layers positioned between the base film and the protective film and are arranged at intervals, and each of the base film and the protective film is an integral piece of film which is continuous in an entire layer. The method further includes partially peeling off the protective film to expose a first adhesive surface of one of the plurality of adhesive layers; attaching the fingerprint module to the exposed first adhesive surface of the adhesive layer; and peeling off the attached fingerprint module and adhesive layer together from the base film to expose a second adhesive surface of the adhesive layer.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

An apparatus for applying self-adhesive labels includes a supporting base for at least one reel of a ribbon that supports self-adhesive labels, elements of feeding the ribbon to a head for applying the self-adhesive labels, and a device for taking up the ribbon. The application head can move on command about an orientation axis in order to vary its own direction of extension with respect to the unwinding direction of the ribbon from the reel. The feeder elements include at least one redirection roller, the rotation axis of which can rotate on command, with respect to the reel, about an adjustment axis that is substantially parallel to the orientation axis in order to bring the direction of extension of the ribbon at the application head.

A method of manufacturing a case for a mobile electronic device is provided for cases having a generally rectangular shape, two long side walls extending substantially parallel to another, and two short end walls extending substantially parallel to one another between the long side walls. The method includes molding a case portion of a first material of a first hardness forming a substantial portion of the side walls and end walls, and a second material of a second hardness extending around the inner periphery of the first material wherein the first hardness is greater than the second hardness, presenting a strip to an outer periphery of the case portion, applying heat and pressure to a backing layer, and removing the backing strip from which the foil has been removed. The present method is advantageous in that it provides a case with a durable and chemically resistive finish.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

An apparatus for coating a part that has an asymmetrical edge. The apparatus includes a film dispenser, a film retriever, a mandrel; and a part holder. Preferably one or both of the mandrel and the part holder move in an angular relationship to one another, and the film dispenser and the film retriever move co-operatively in at least two dimensions with respect to the part holder. There is further provided a film having a first edge and a second edge, and the film can be a decorative coating, a protective coating or combinations of these. The film dispenser holds the first edge of the film, the film is positioned between the mandrel and the part holder and the film retriever holds the film second edge.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A system, apparatus, and method for removing pressure adhesive indicia, such as labels or stamps, from their backing and affixing the same to a target substrate is provided. The automated process affixes stamps, for example, to the target substrate with both speed and precision of placement. Desired stamps can be selectively removed from a backing, for example, can be placed on variable locations upon the target substrate, and can be affixed in the desired orientation with precise spacing between stamps. The precision of affixation afforded by this system is commensurate with philatelic standards and is suitable for all pressure adhesive indicia where rapid and precise placement is desired for aesthetic or other reasons.