A display device includes a cover window including a curved portion, and a panel member laminated on the cover window. A method of manufacturing a display device includes mounting a cover window including a curved portion on a first jig including a curved portion, mounting a panel member on a second jig that conforms to a surface of the first jig, and laminating the cover window to the panel member by moving a first one of the first jig or the second jig to a first other one of the first jig or the second jig. An apparatus for manufacturing a display device includes a first jig including a mount surface that is partially curved to conform to a surface of a cover window, a second jig including a surface conforming to the mount surface and configured to contact a panel member, and a driving unit.

A carrying mechanism for providing placement of at least one flexion item to a sponge pool having a lower sponge and a lateral sponge particularly used in mattress production includes at least one holder for fixing said flexion item thereon, at least one compression mechanism configured to at least partially compress the flexion item from the sides towards the center thereof, and at least one pushing group configured to separate the flexion item from the carrying mechanism in the sponge pool.

A high altitude balloon, including a method and machine for manufacture, uses a perimeter border strip to couple two circular balloon panels with a lap or butt seal. Simultaneous sealing of two perimeter seals, one between the border strip and each of two balloon panels, is provided by supporting stacked balloon panels on a rotatable support and sealing around the full perimeter of the two interposed balloon panels and the border strip. The method and machine for manufacture allow for the mass production of high altitude balloons and minimize necessary material handling. The perimeter border strip can be dispensed and guided relative to the perimeter of the balloon panels for positioning before sealing together, as a bonding device is rotated relative to the balloon envelope.

An automated method and system for a conveyor holding system for holding vials of a multi-vial order in a holding pattern until all vials of the order have been filled by an automatic pill counter. The system uses RFID information to divert vials off the conveyor into the conveyor holding loop if all vials of the multi-vial order have not been filled. The system is adapted to divert the vials of the multi-vial order out of the holding loop when all vials of the multi-vial order have been filled.

Disclosed is an automatic bonding system for an LCD device. The automatic bonding system includes a bonding unit configured to perform a process of bonding a first substrate to a second substrate, a first substrate supply unit configured to include an inverting arm and supply the first substrate to the bonding unit, a second substrate supply unit configured to include an adhesive resin coating unit and supply the second substrate to the bonding unit, a pre-hardening unit configured to perform a process of pre-hardening an adhesive resin that adheres the first and second substrates, and a hardening unit configured to perform a process of hardening the adhesive resin that adheres the first and second substrates. A gap between the first and second substrates bonded to each other by the bonding unit is a bonding gap controlled by a gap variable control stage.

An apparatus for and a method of bonding a first substrate and a second substrate are provided. In an embodiment a first wafer chuck has a first curved surface and a second wafer chuck has a second curved surface. A first wafer is placed on the first wafer chuck and a second wafer is placed on a second wafer chuck, such that both the first wafer and the second wafer are pre-warped prior to bonding. Once the first wafer and the second wafer have been pre-warped, the first wafer and the second wafer are bonded together.

An apparatus and method for labelling packs including an advancement device for transporting a pack in a transporting direction, a dispensing device for dispensing a label into a dispensing position, and an application device for applying the dispensed label to the pack. A punch including a punch shank and punch foot moves the dispensed label from a receiving position, where the punch foot receives the label, to a discharging position, where the label is applied to the pack by the punch foot. The punch shank is pivotally mounted about a first pivot axis transverse to the transporting direction, and is movable axially in a guide element. The punch shank is connected to a lifting element of a lifting device via an articulation. The lifting element is movable parallel to a direction angled relative to the transporting direction. A first drive with a motor drives the lifting element.

An apparatus for bundling containers includes a linear conveyor, a guide element, conveying elements, and application elements, each of which applies adhesive to a portion of a container surface, The conveying elements are driven and controllable to travel along the conveyor and to circulate along the guide element. Each conveying element has a container guide that rotates relative to the conveying element. The guide element has a feed strand with central, transition, and end sections that merge into each other. The central section is further from the central axis than the end section. The distance from end section to central axis is such that containers circulating on the end section are brought into contact with adhesive on a surface of an adjacent container.

Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robotics handler is disposed within the chamber that is adapted to move a plurality of semiconductor wafers within the chamber between the plurality of sub-chambers. The plurality of sub-chambers includes a first sub-chamber adapted to remove a protection layer from the plurality of semiconductor wafers, and a second sub-chamber adapted to activate top surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together. The plurality of sub-chambers also includes a third sub-chamber adapted to align the plurality of semiconductor wafers and hybrid bond the plurality of semiconductor wafers together.

A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of upper and lower block assemblies of the apparatus. In some cases, the leveling adjustment system may include a plurality of threaded posts, differentially threaded adjustment collars, and leveling sleeves. In some instances, the leveling adjustment system further may include a plurality of preload springs configured to provide a given preload capacity and range of adjustment. In some instances, the leveling adjustment system further may include a load cell through which one of the threaded posts may be inserted. In some embodiments, the upper block assembly further may include a reaction plate configured to reduce deformation of the upper block assembly. In some embodiments, the upper block assembly further may include a thermal isolation plate configured to provide compliance deflection and being of monolithic or polylithic construction, as desired.