An overlay applicator can include an overlay with a top side and a bottom side. The bottom side can include an adhesive agent configured to adhere to a screen of an electronic device. The overlay applicator can include an adhesive release liner. The adhesive release liner can include a top side and a bottom side. The top side of the adhesive release liner can be removably attached to the bottom side of the overlay. The adhesive release liner can be configured to protect the adhesive agent at the bottom side of the overlay from contaminants. The overlay applicator can include a protective film removably attached to the top side of the overlay. The overlay applicator can include an alignment tab. The alignment tab can include an alignment mechanism. The overlay applicator further can include a pull tab. The pull can include a wiper. Other embodiments are provided.

An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.

The particle impregnating device includes a placing body for placing a nonwoven fabric having a surface on which particles are sprayed; a vibrating member which is provided above the placing body and extends in the width direction of the nonwoven fabric placed on the placing body; a vibrator which applies ultrasonic vibration to the vibrating member; a lifting mechanism which lifts up and down the vibrating member; and a moving mechanism which relatively moves the nonwoven fabric and the vibrating member in a surface direction orthogonal to the width direction of the nonwoven fabric. When the nonwoven fabric and the vibrating member are relatively moved by the moving mechanism, the vibrating member is lowered by the lifting mechanism, so that the nonwoven fabric is pressed and compressed by the vibrating member and ultrasonic vibration is applied to the vibrating member by the vibrator.

The present invention relates to a punch foot (1) for a label punch (2) of a device (3) for labeling individual packs (4), having a punch foot housing (5) which in an extent direction (E) extends from a first housing end (5a) having a first housing opening (6a) to a second housing end (5b) having a second housing opening (6b); having a pressure duct (7) which in the punch foot housing (5) extends from the first housing opening (6a) in the extent direction (E); having a perforated plate (8) which closes the second housing opening (6b) and is connected to the punch foot housing (5), by way of which at least one primary nozzle (9) extends in an orientation direction (V); having a pressure chamber (10) which in the punch foot housing (5) extends from the perforated plate (8) counter to the extent direction (E) and which in a manner orthogonal to the extent direction (E) is on all sides delimited by a punch foot housing wall portion (11); having a connection portion (12) which in the punch foot housing (5) in the extent direction (E) extends between the pressure duct (7) and the pressure chamber (10) and which connects the pressure duct (7) to the pressure chamber (10); and having a control element (13) which is disposed in the pressure chamber (10) and which is movable between two terminal positions (I, II) that effect dissimilar flows through the pressure chamber (10); whereby the at least one primary nozzle (9) connects the pressure chamber (10) to the environment of the punch foot housing (5). In order for the handling to be simplified, the invention proposes that at least one secondary nozzle (14) which connects the pressure chamber (10) to the environment of the punch foot housing (5) extends through the punch foot housing wall portion (11) that delimits the pressure chamber (10) on all sides in a manner orthogonal to the extent direction (E). The invention furthermore relates to a device (3) and to a method for labeling individual packs (4).

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A machine for carrying out at least one operation onto a first article and a second article is disclosed. The machine comprises feeding means for advancing a succession of the first article and the second article along a path and with a first speed; a first operative group, which comprises a first tool configured for carrying out operation onto the first article and which can be operated with a second speed associated to the first speed; gap creating means selectively controllable to create a first gap, which is arranged inside succession and is bounded between the first article and the second article; and a second operative group, which comprises a second tool configured for carrying out operation onto the second article and which can be operated at the second speed.

Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robotics handler is disposed within the chamber that is adapted to move a plurality of semiconductor wafers within the chamber between the plurality of sub-chambers. The plurality of sub-chambers includes a first sub-chamber adapted to remove a protection layer from the plurality of semiconductor wafers, and a second sub-chamber adapted to activate top surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together. The plurality of sub-chambers also includes a third sub-chamber adapted to align the plurality of semiconductor wafers and hybrid bond the plurality of semiconductor wafers together.

A process and system for making a laminated surface covering and the surface covering itself are described. The covering includes several layers bonded to each other. The system performs the process. One example of the process includes passing a first material across a first conveyor, passing a second material across a second conveyor, passing a bonding material across a third conveyor, contacting the first material and the second material to the bonding material, and heating at least one of the first material and the second material. The process also includes introducing the first material, the second material, and the bonding material into a pressure zone such that the bonding material is introduced between a bottom surface of the first material and a top surface of the second material. The process applies pressure to bond the first material and second material together via the bonding material to produce a laminated material.

An automated method and system for a conveyor holding system for holding vials of a multi-vial order in a holding pattern until all vials of the order have been filled by an automatic pill counter. The system uses RFID information to divert vials off the conveyor into the conveyor holding loop if all vials of the multi-vial order have not been filled. The system is adapted to divert the vials of the multi-vial order out of the holding loop when all vials of the multi-vial order have been filled.

Disclosed herein are a screen protector assembly, a screen protector applying assembly and a screen protector applicator. The screen protector assembly comprises a screen protector layer, a retention layer and a first matching member. The retention layer is bonded to the screen protector layer. The first matching member is fixedly connected to the retention layer, and the first matching member is used to be detachably connected to a protector applying assembly. With the above arrangement, a detachable connection between the retention layer of the screen protector assembly and the protector applying assembly is realized, allowing the retention layer to be detached from the protector applying assembly after a protector is applied to a screen, thereby allowing the protector applying assembly to be reused, and saving costs.