The present invention relates to a peeling bar, apparatus, and method for peeling a polarizing film from a panel. This invention can minimize friction between the peeling bar and the polarizing film since the peeled polarizing film is in contact with a roller of the peeling bar. The radius of the roller of the peeling bar and the inclined surface of the fixing unit are designed to minimize the Z-axis component of a shearing force applied to the polarizing film. Also, in order to equalize tension applied to the polarizing film in a peeling process, this invention makes both ends of the polarizing film closely adhere to the peeling bar.

According to this invention, fracture of the polarizing film is prevented, and thereby the polarizing film can be stably peeled from the panel without fracture.

Described herein is an apparatus and a method for removing an epoxy resin from a backing sheet at a temperature at or below the glass transition temperature of the epoxy resin. The apparatus (200) comprises a housing (210) in which is mounted a dispensing roll (220) comprising epoxy resin (230) on a backing sheet (240), a wind-up roll (250) comprising the backing sheet (240), a release element (260) over which the backing sheet (240) is directed, and a collection tray (270) for collecting pieces of resin (230a) removed from the backing sheet (240). The dispensing and wind-up rolls (220, 250) are mounted on respective drive shafts (225, 255) which are driven by a drive mechanism (285) controlled by a controller (280). A temperature controller (290) is also provided for controlling the temperature within the housing (210) so that it remains below or at the glass transition temperature of the epoxy resin. Angle (a) is chosen to optimize the peel-back angle of the backing sheet (240) after is passes over the release element (260) in relation to the relative spacing between the dispensing and wind-up rolls (220, 250) and the release element (260).

A first surface of a debonder defines a recess that holds an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface. The second surface includes suction openings that deliver suction to the recess. A third surface of the debonder substantially connects the first and the second surfaces and includes an opening dimensioned to limit a pressure differential between the recess and outside the recess during application of the suction.

A first surface of a debonder defines a recess to hold an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The carrier plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the carrier plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface, where the second surface includes suction openings that deliver a suction force to the recess, and a portion of the second surface is in contact with a heat source.