A method of recycling a solar cell module includes an enclosing layer that encloses a solar cell therein, a light-receiving surface layer laminated on one surface of the enclosing layer, and a back sheet laminated on the other surface of the enclosing layer, the method including: a first removing step of mechanically removing the back sheet; a second removing step of mechanically removing from a side on which the back sheet is removed the entire solar cell and the enclosing layer to such a depth that a part of the enclosing layer having a predetermined thickness remains on the light-receiving surface layer, after the first removing step; and a third removing step of removing the part of the enclosing layer remaining on the light-receiving surface layer by immersion in a solution that causes swelling of the enclosing layer, after the second removing step, thereby improving an overall efficiency.

An extractor system for extracting an object secured to another object or a base surface is disclosed, which may include an oscillator, an attachment base, and an oscillation control mechanism to limit the transmission of oscillation forces after the object has become unsecured, and preserve the target object in good condition. The attachment base may be a vacuum suction cup or temporary adhesive. The control system may be a mechanical lifting system or an electronic control adapted to cease or minimize application of vibrational force when the object becomes unsecured. Methods of extracting an object or separating two objects secured to each other are also disclosed, including identification or creation of partial unbonded areas beneath the target object to initiate the de-bonding process prior to application of vibrational forces.

Methods of preparing laminate test samples for subsequent testing, including positioning the test sample within a fixture body, securing the test sample within the fixture body, applying a separating force to urge a first layer portion of the test sample away from a second layer portion of the test sample, and separating the first layer portion from the second layer portion to create a predetermined separation length along the test sample, provided that the predetermined separation length is established by an interaction between the fixture body and the test sample as the first layer portion is separating from the second layer portion.

In a method and a device for recycling a thermoplastic fibre-reinforced composite material, which is in at least one deposition layer in a component (1), it is suggested that said fibre-reinforced composite material should be pulled off from the remaining component (1), in the direction of a main fibre direction, in at least one pull-off layer (10) comprising fibres and matrix material.

Disclosed are a glass substrate separation device and a glass substrate separation method. A plurality of first vacuum adsorption devices is adsorbed on one end of the glass substrate to separate the one end of the glass substrate and an OLED with an opening with a certain distance, and a metal wire is driven to enter the opening, and abuts a lower surface of the glass substrate to move to the other end of the glass substrate to accomplish the separation between the glass substrate and the OLED; and then, a second vacuum adsorption device is adsorbed at an intermediate position of the glass substrate to remove the glass substrate from the OLED to realize a glass substrate removal process after a LLO in an OLED module production, thereby avoiding a damage to the OLED and a PI layer disposed on a surface layer of the OLED.

A component supply device is a device for supplying components housed in a component storage tape to a component extraction position. The component storage tape traveling toward a component exposure part is guided by a tape guide. This tape guide includes a guide body, and first and second positioning guide members. In the tape guide, the guide body includes a pair of side wall parts that defines a fourth tape traveling path wider than a maximum allowable width of the component storage tape. In the tape guide, the first and second positioning guide members and include first and second bent parts respectively that function as a pair of tape side surface guide parts that guides side surfaces of the component storage tape. The first and second bent parts are apart from each other at a distance shorter than a width of the fourth tape traveling path.

A film-peeling apparatus is adapted to peel a protective film on a surface of a substrate. The surface of the substrate has a bare area which is not covered by the protective film. The film-peeling apparatus includes a punching member, a connector connected to the punching member, and a controller. The controller is configured for driving, through the connector, the punching member to punch at predetermined positions nearby or on a first edge of the protective film adjacent to the bare area.

A peeling method is provided. In a first step, a resin layer is formed over a support substrate, openings are formed along two opposite sides of a periphery of the resin layer in a top view, an element layer is formed over the resin layer and positioned on an inner side than the openings in the top view, and the support substrate and a counter substrate are bonded to each other so that an adhesive layer is in contact with the support substrate in the openings, thereby forming a process member. In a second step, an entire surface of the process member is irradiated with light from the support substrate side. In a third step, a blade is inserted into an end portion of the process member from an interface between the support substrate and the resin layer or from the resin layer, and is made to pass through the openings.

A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.

A starting point for separating a separation layer and a layer to be separated is formed in a process member. A first step of irradiating a first portion of the process member with first laser light in a frame-like shape and a second step of irradiating at least part of a region which is irradiated with the first laser light with second laser light are performed. The process member includes a first substrate, the separation layer, the layer to be separated, and an adhesive layer which are stacked in this order. In the first portion, the adhesive layer overlaps with the first substrate with the separation layer and the layer to be separated provided therebetween. In the first step, the first laser light is absorbed by at least the layer to be separated and the adhesive layer. In the second step, the second laser light is absorbed by at least the separation layer.