A method is for producing biological material-coated solid-phase fragments. The method first provides a biological material-coated solid-phase support in a fragmented state and the biological material-coated solid-phase fragment adhered to a film. Then, a tensile stress is generated on the film, which is then contacted with a lifting head to pre-detach the biological material-coated solid-phase fragment from the film. The fragment is then taken off from the film. A device for producing the biological material-coated solid-phase fragment includes a tensile-stress unit, a lifting-head unit and a removal unit.

An object of the present invention is to make it possible to easily remove a carrier film when removing the carrier film from a gasket body in a carrier-film-equipped gasket, which includes a combination of a rubber-only type gasket body and a resinous carrier film that retains the gasket body, even if the gasket body is adhered to the carrier film. To fulfill the object, a step for peeling, against an adhesive force, the carrier film from the gasket body in a state in which the gasket body is fixed to a base, is carried out. As a preliminary step of the peeling step, the gasket body is pressed from the carrier film side by a pressing device thereby to decrease the adhesion area between the gasket body and the carrier film, and the peeling step is carried out in a state in which the adhesion area has been decreased.

A semiconductor manufacturing apparatus includes: a sheet separation jig having contact with a rear surface of a sheet which is a surface of the sheet on a side opposite to a front surface of the sheet, wherein the sheet separation jig includes therein a plurality of support blocks each having a first suction hole formed for sucking the rear surface of the sheet and a single driving plate connected to the plurality of support blocks so that the plurality of support blocks can move in a first direction as a direction away from the sheet with a time difference, and the plurality of support blocks are disposed in the sheet separation jig along a second direction, as a direction of a separation of the semiconductor device from the sheet, intersecting the first direction.

A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

A film separation apparatus and a film separation method are disclosed. The film separation apparatus includes a mechanical arm, a needle and a stopping member; the needle has one end connected to the mechanical arm and the other end including a needle tip; the stopping member includes a connecting rod and a stopper, the connecting rod has one end connected to the mechanical arm and the other end connected to the stopper, the needle tip is configured to be inserted into a film to be separated, the stopper and the needle tip are configured to move with respect to each other in an extension direction of the needle so as to separate the film to be separated from the needle tip.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

A film separation apparatus and a film separation method are disclosed. The film separation apparatus includes a mechanical arm, a needle and a stopping member; the needle has one end connected to the mechanical arm and the other end including a needle tip; the stopping member includes a connecting rod and a stopper, the connecting rod has one end connected to the mechanical arm and the other end connected to the stopper, the needle tip is configured to be inserted into a film to be separated, the stopper and the needle tip are configured to move with respect to each other in an extension direction of the needle so as to separate the film to be separated from the needle tip.

A method for separating a window includes providing a display device including a display panel, a window disposed on the display panel and including a color layer. An adhesive layer is disposed between the display panel and the window. Heat is applied to the display device. The method includes inserting a disassembling stick between the display panel and the window to separate an edge of the display panel from the window. The method includes cooling the display device. The method includes separating the display panel and the window from each other.

A detaping machine is adapted for removing a tape from a frame, the tape includes a wafer mounting area and a periphery area surrounding the wafer mounting area. The detaping machine includes a carrier and a detaping module. The carrier is for supporting the tape and the frame. The detaping module includes an elastic pressing device and a detaping head, wherein the periphery area of the tape is adapted to be pressed by the elastic pressing device, and the wafer mounting area of the tape is adapted to be pressed by the detaping head. A detaping method is further provided.