Patent classifications
Y10T409/300896
Components of an electronic device and methods for their assembly
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Compound machining method and apparatus
A method of machining a workpiece may include continuously rotating the workpiece, continuously rotating a tool having at least one cutting surface, and positioning the tool relative to the workpiece so that the at least one cutting surface engages the workpiece at a first discrete location at a periphery of the workpiece. The method may further include continuing to rotate the workpiece and the tool so that the at least one cutting surface engages a second discrete location at the periphery of the workpiece, and controlling a tool surface velocity VT relative to the workpiece surface velocity VW so that the first and second discrete locations are discontinuous. The tool may make multiple iterative passes over the workpiece to engage subsequent discrete locations, wherein the first discrete location, second discrete location, and multiple subsequent discrete locations may form a machined surface that extends continuously around the workpiece.
Method of setting heat-resistant alloy cutting conditions and method of cutting heat-resistant alloy
In a method of setting heat-resistant alloy cutting conditions used to set cutting conditions under which a heat-resistant alloy is cut with a cutting tool, the cutting tool has a long shaft mounted on a spindle and extended in the axial direction and teeth formed on the shaft. The cutting conditions include a radial direction cutting amount of the cutting tool in the radial direction. When the radial direction cutting amount in which one tooth is constantly in contact with the heat-resistant alloy is given as a smallest radial direction cutting amount and the radial direction cutting amount in which three or more teeth are not in contact with the heat-resistant alloy is given as a largest radial direction cutting amount, a radial direction cutting amount of the cutting tool is set in the range from the smallest radial direction cutting amount to the largest radial direction cutting amount.
COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
METHOD OF SETTING HEAT-RESISTANT ALLOY CUTTING CONDITIONS AND METHOD OF CUTTING HEAT-RESISTANT ALLOY
In a method of setting heat-resistant alloy cutting conditions used to set cutting conditions under which a heat-resistant alloy is cut with a cutting tool, the cutting tool has a long shaft mounted on a spindle and extended in the axial direction and teeth formed on the shaft. The cutting conditions include a radial direction cutting amount of the cutting tool in the radial direction. When the radial direction cutting amount in which one tooth is constantly in contact with the heat-resistant alloy is given as a smallest radial direction cutting amount and the radial direction cutting amount in which three or more teeth are not in contact with the heat-resistant alloy is given as a largest radial direction cutting amount, a radial direction cutting amount of the cutting tool is set in the range from the smallest radial direction cutting amount to the largest radial direction cutting amount.
COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Components of an electronic device and methods for their assembly
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Anodizing resistant components and methods of use thereof
Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.
COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
HIGH PERFORMANCE MULTI-AXIS MILLING
Technology for milling selected portions of a workpiece by a cutting tool of a numerical control machine is described. The described technology provides methods and apparatuses for milling areas of a part so that more aggressive machining parameters can be used in the toolpath, thereby resulting in reduced machining time and load. The described technology additionally determines directions of the tool axis vector at points along a toolpath in order to achieve a desired part shape while optionally maintaining high material removal rates.