Y10T428/12028

CORROSION PROTECTION WITH AL/ZN-BASED COATINGS

Red rust staining of Al/Zn coated steel strip in acid rain or polluted environments can be minimised by forming the coating as an AlZnSiMg alloy coating with an OT:SDAS ratio greater than a value of 0.5:1, where OT is the overlay thickness on a surface of the strip and SDAS is the measure of the secondary dendrite arm spacing for the Al-rich alpha phase dendrites in the coating. Red rust staining in acid rain or polluted environments and corrosion at cut edges in marine environments can be minimised in AlZnSiMg alloy coatings on steel strip by selection of the composition (principally Mg and Si) and solidification control (principally by cooling rate) and forming Mg.sub.2Si phase particles of a particular morphology in interdendritic channels.

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 m or more to 1000 m or lower.

Copper foil for printed circuit

A copper foil for printed circuits is prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer. The average particle size of the primary particle layer is 0.25 to 0.45 m, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 m. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

Plasmonic Nanoparticle Layers with Controlled Orientation

An article comprising one or more layers of plasmonic nanoparticles located between opposing layers of dielectric materials.

Flourination process to create sacrificial oxy-flouride layer

An article comprises a body having a coating. The coating comprises a YOF coating or other yttrium-based oxy-fluoride coating generated either by performing a fluorination process on a yttrium-based oxide coating or an oxidation process on a yttrium-based fluorine coating.

Scavenging oxygen

A container (22) includes an oxygen-sensitive beverage, for example a vitamin C-containing beverage. A closure (40) seals the mouth (28) of container (22). The closure includes an oxygen scavenging structure, for example a closure, which comprises a hydrogen generating means and a catalyst for catalysing a reaction between hydrogen and oxygen.

Method for producing metal oxide layers of predetermined structure through arc vaporization

The invention relates to a method for producing layers consisting of ternary and higher oxides of metallic and semi-metallic components, wherein the formation temperature of these oxides can be determined essentially through the composition of the binary (or higher) alloy targets (based on the phase diagram).

Transparent conductive film

The present invention discloses a novel and inventive transparent conductive film Differing from conventional metal mesh substrates are mainly constituted by silver nanowires (AgNW), the present invention particularly designs a nano metal wire consisting of a metallic core wire, a transition layer and a protection layer, and further develops a transparent conductive film consisting of a substrate and a metal mesh layer; wherein the metal mesh layer is constituted by the said nano metal wires. It is worth describing that, a variety of experimental data prove that the thermal resistance of this novel transparent conductive film is up to 400 C.; moreover, experimental data also exhibit that the transparent conductive film can filter part of blue light portion out of a white light by 20-30%.

Cemented carbide body and method for manufacturing the cemented carbide body
10226820 · 2019-03-12 · ·

A method for manufacturing a cemented carbide body includes the steps of forming a first part of a first powder composition comprising a first carbide and a first binder phase, sintering the first part to full density in a first sintering operation, forming a second part of a second powder composition comprising a second carbide and a second binder phase, sintering the second part to full density in a second sintering operation, bringing a first surface of the first part and a second surface of the second part in contact, and joining the first and second surface in a heat treatment operation.

CERMET POWDER, PROTECTIVE-COATING-COATED MEMBER AND METHOD OF PRODUCING SAME, AND ELECTROPLATING-BATH-IMMERSED ROLL AND METHOD OF PRODUCING SAME

Disclosed is a cermet powder that enables preparation of a cermet coating having both high wear resistance and high corrosion resistance against a strong acid having a pH of less than 1. The disclosed cermet powder contains tungsten carbide particles in an amount of 40 mass % or more; molybdenum carbide particles in an amount of 10 mass % to 40 mass %; and Ni or a Ni alloy as a matrix metal, wherein the cermet powder further contains chromium, either as a carbide or a metal or alloy element contained in the matrix metal, in an amount of 8 mass % or more.