A steel sheet with a metallic coating is provided. A composition of the metallic coating includes from 2.0 to 24.0% by weight of zinc, from 7.1 to 12.0% by weight of silicon, optionally from 1.1 to 8.0% by weight of magnesium, and optionally additional elements chosen from Pb, Ni, Zr, or Hf. The content by weight of each additional element is less than 0.3%. A balance of the composition is aluminum, unavoidable impurities and residual elements. A ratio Al/Zn is from 4.0 to 6.0.

The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like. A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 ?m or more and 20 ?m or less.

There is provided a roughened copper foil which can significantly improve adhesion to an insulating resin and reliability (e.g., hygroscopic heat resistance). The roughened copper foil of the present invention has at least one roughened surface having fine irregularities composed of acicular crystals, wherein the entire surface of the acicular crystals is composed of a mixed phase of Cu metal and Cu.sub.2O.

A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

The present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil, in which, in the manufacture of the electrolytic copper foil for graphene, addition of nickel facilitates the synthesis of the graphene. The addition of nickel which serves as a seed in the synthesis of graphene on electrolytic copper foil reduces the electrical conductivity after graphene synthesis. As a result, graphene is uniformly formed on the surface of the copper foil. Further, the present disclosure may provide the electrolytic copper foil for graphene and the method for producing the copper foil in which an electrolytic copper foil having a resistance value of less than 300 ohm/square after the synthesis of the graphene on the electrolytic copper foil is produced, thereby, facilitate the formation of graphene on the electrolytic copper foil.

A cladding material for stainless steel clad steel plate, includes, by mass %, 0.03% or less carbon, 1.5% or less silicon, 2.0% or less manganese, 0.04% or less phosphorus, 0.03% or less sulfur, 22.0% to 25.0% nickel, 21.0% to 25.0% chromium, 2.0% to 5.0% molybdenum, 0.15% to 0.25% nitrogen, and the balance being iron and incidental impurities, wherein critical pitting temperature (CPT) after normalization as determined in accordance with ASTM G48-03 Method E is 45 C. or higher, and corrosion loss at a welded zone as determined by a corrosion test in accordance with NORSOK Standard M-601 is 1.0 g/m.sup.2 or less.

A steel foil according to an aspect of the present invention includes a rolled steel foil; and a Ni having <111>//RD texture plated on an outermost layer of the rolled steel foil. Regarding the steel foil, a <111> pole density in an inverse pole figure of a rolling direction may be 3.0 or more and 6.0 or less.

One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90, and a strength ratio TS.sub.TD/TS.sub.LD of tensile strength TS.sub.TD in a direction perpendicular to a rolling direction to tensile strength TS.sub.LD in a direction parallel to the rolling direction exceeds 1.09.

An article comprising an electrodeposited aluminum alloy is described herein. The electrodeposited aluminum alloy comprises an average grain size less than approximately 1 micrometer. The electrodeposited aluminum alloy thickness is greater than approximately 40 micrometers. A ductility of the electrodeposited aluminum alloy is greater than approximately 2%.

There is provided a copper foil provided with a carrier providing excellent chemical resistance against the copper flash etching solution during the formation of the wiring layer on the surface of the coreless support and excellent visibility of the wiring layer due to high contrast to the antireflective layer in image inspection after copper flash etching. The copper foil provided with a carrier comprises a carrier; a release layer provided on the carrier; an antireflective layer provided on the release layer and composed of at least one metal selected from the group consisting of Cr, W, Ta, Ti, Ni and Mo; and an extremely-thin copper layer provided on the antireflective layer; wherein at least the surface adjacent to the extremely-thin copper layer of the antireflective layer comprises an aggregate of metal particles.