Patent classifications
Y10T428/12438
Sanitary equipment part
A part includes a base material, a colored layer, an intermediate layer, and a water-repellent-surface layer. The colored layer contains 35 at % to 99 at % of C, 0 at % to less than 40 at % of Cr, 0 at % to less than 15 at % of N, and more than 0 at % to less than 15 at % of O. The intermediate layer contains at least one metal atom selected from Cr, Zr, and Si; and an oxygen atom. The intermediate layer exhibits a sputtering time of 0.5 minutes or more to 9 minutes or less.
METAL CONDUCTING STRUCTURE AND WIRING STRUCTURE
A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.
Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal
The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.10<Sn/(Ni+Fe)<5.00 were satisfied by atomic ratio, and a yield ratio YS/TS is more than 90% which is calculated from a strength TS and a 0.2% yield strength YS when a tensile test is performed in a direction parallel to a rolling direction.
METALLIC DECORATIVE PART FOR VEHICLE DISPLAY DEVICE, AND VEHICLE DISPLAY DEVICE
A metallic decorative part for a vehicle display device includes a substrate body molded from a synthetic resin, a metal thin film that is formed of metal and deposited on a surface of the substrate body, and a plurality of grooves deposited on a surface of the metal thin film in accordance with a shape of the surface of the substrate body. The grooves are formed so that a width is larger than 0 and equal to or smaller than 3.0 m, and a height is larger than 0 and equal to or smaller than 1.0 m. Accordingly, the metallic decorative part for a vehicle display device can properly secure a metallic texture recognized by a viewer with a configuration in which the metal thin film is deposited on the surface of the substrate body made of resin.
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1 to 5 grains/m.sup.2, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 m.
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 m, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 m.
Composite metal foil
A composite metal foil and a method of manufacturing the same are provided. The composite metal foil includes at least a first metal layer and a second metal layer. The first metal layer is copper foil, nickel foil, stainless steel foil, or a combination thereof. The second metal layer is disposed on a surface of the first metal layer. A contact angle of a surface of the second metal layer to liquid lithium metal is lower than 90 degrees.
Alloy ribbon and laminated core
An alloy ribbon that is an alloy ribbon containing a metal as a main component, and has a recess on at least one principal surface, in which a depth of the recess is 5% or more and 75% or less of an average thickness.
Coated steel sheet with thin aluminium alloy coating and coating method thereof
Coated steel sheet used for hot stamping has a thin aluminium alloy coating with coating thickness of 514 m. The aluminium alloy coating has a FeAlSi inhibitive layer adjacent to a substrate steel sheet and an Al alloy layer outside the FeAlSi inhibitive layer. The thickness of the FeAlSi inhibitive layer is no more than 60% of the coating thickness and is 1.56.0 m. Diameters of Kirkendall voids within 2 m from an interface between the FeAlSi inhibitive layer and the substrate steel to the interior of the substrate steel are no more than 2.5 m, and the number of Kirkendall voids with a diameter of no less than 0.5 m and no more than 2.5 m does not exceed 15 per 35 m. The coating method eliminates skip coating and resulting hot stamped component has excellent resistance spot welding performance.
METHOD OF MANUFACTURING COMPOSITE METAL FOIL
A method of manufacturing a composite metal foil includes providing a first metal layer and forming a second metal layer on a surface of the first metal layer through electroplating. The first metal layer is copper foil, nickel foil, stainless steel foil, or a combination thereof. A contact angle of a surface of the second metal layer to liquid lithium metal is lower than 90 degrees.