This steel sheet for containers includes a steel sheet, a Sn coated layer that is formed on at least one surface of the steel sheet, and a chemical treatment layer that is formed on the Sn coated layer. The Sn coated layer contains 300 mg/m.sup.2 to 5,600 mg/m.sup.2 of Sn in terms of an amount of metal Sn, and the chemical treatment layer contains 5 mg/m.sup.2 to 30 mg/m.sup.2 of a Zr compound in terms of an amount of metal Zr, an average roughness Ra of an outermost surface of the chemical treatment layer obtained with a scanning probe microscope is 10 nm to 100 nm. A variation amount in a yellowness index measured at one measurement point on the outermost surface of the chemical treatment layer is defined as YI represented by Equation (1), an average of absolute values of the YI obtained at a plurality of the measurement points included in a unit area of the outermost surface is 5.0 or less.

YI=YIYI.sub.0(1) where YI: the yellowness index measured after the steel sheet for containers is subjected to a retort treatment at a temperature of 130 C. for 5 hours, YI.sub.0: the yellowness index measured before the retort treatment

A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

An electric contact material for a connector includes a base material made of a metal material; an alloy layer that is formed on the base material and made of an alloy containing at least three elements including Sn and Cu as well as at least one metal selected from Zn, Co, Ni, and Pd; and a conductive coating layer formed on the surface of the alloy layer. The alloy layer contains an intermetallic compound obtained by replacing some of the Cu atoms in Cu.sub.6Sn.sub.5 with at least one metal selected from Zn, Co, Ni, and Pd. It is preferable that the content of at least one metal selected from Zn, Co, Ni, and Pd in the alloy layer is in a range of 1 to 50 atom % when the total content of the metal and Cu is regarded as 100 atom %.

The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.

A steel sheet for a container includes: a steel sheet; a coated layer which contains Ni and is provided as an upper layer of the steel sheet; and a chemical treatment layer which is provided as an upper layer of the coated layer, and contains a Zr compound in an amount of 3.0 to 30.0 mg/m.sup.2 in terms of Zr metal, and a Mg compound in an amount of 0.50 to 5.00 mg/m.sup.2 in terms of Mg metal, in which the coated layer is one of the group consisting of a Ni coated layer which contains Ni in amount of 10 to 1000 mg/m.sup.2 in terms of Ni metal, and a composite coated layer which contains Ni in an amount of 5 to 150 mg/m.sup.2 in terms of Ni metal and Sn in an amount of 300 to 3000 mg/m.sup.2 in terms of Sn metal, and has an island-shaped Sn coated layer formed on an FeNiSn alloy layer.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.

It is aimed to provide a plated member and a plated terminal for connector, to which a large current can be applied and which have both a low friction coefficient and high heat resistance, at low cost and provide a method for producing such a plated member and a method for producing such a plated terminal for connector. A silver-tin alloy layer for coating a surface of a base material made of copper or copper alloy and a silver coating layer for coating the silver-tin alloy layer and to be exposed on an outermost surface are simultaneously formed by heating to obtain a plated member after tin and silver plating layers are alternately laminated on the surface of the base material with the outermost surface formed by the silver plating layer.

A steel sheet for containers that has excellent film adhesion qualities, and has; a chemical conversion coating formed by immersing or subjecting to electrolytic treatment a steel sheet in a solution containing Zr ions, F ions, with adhesion amount of 0.1 to 100 mg/m.sup.2 for metal Zr and no more than 0.1 mg/m.sup.2 for F; and a hydroxyl acid treatment layer formed on the chemical conversion coating, the layer having a C adhesion amount of 0.05 to 50 mg/m.sup.2.