A blow molded multilayer article with a hollow body defined by a wall with an inner surface and an outer surface. The outer surface has an axial color gradient and/or a gloss gradient. The wall has multiple layers and at least one layer contains an effect pigment and/or an opacifying pigment.

A container includes a cup formed to include and interior region and an insulated sleeve. The insulated sleeve is coupled to an outer surface of the cup.

A component for a processing chamber includes a ceramic body having at least one surface with a first average surface roughness. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 μm over the at least one surface and having a second average surface roughness that is less than the first average surface roughness.

Provided is a conductive polymer dispersion, including: a conductive composite containing a π-conjugated conductive polymer and a polyanion; a vinyl versatate polymer; and a dispersion medium.

Textile hose for encasing elongated objects, characterised by having a radially elastic outer layer made from wear-resistant material and at least one inner layer made from thermally insulating material.

Disclosed are embodiments for an engineered feature formed as a part of or on a chamber component. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has an outer surface. An engineered complex surface is formed on the outer surface. The engineered complex surface has a first lattice framework formed from a plurality of first interconnected laths and a plurality of first openings are bounded by three or more laths of the plurality of laths.

Thin PTFE layers are described having little or no node and fibril microstructure and methods of manufacturing PTFE layers are disclosed that allow for controllable permeability and porosity of the layers. In some embodiments, the PTFE layers may act as a barrier layer in an endovascular graft or other medical device.

A component for a semiconductor processing chamber includes a ceramic body having at least one surface with a first average surface roughness of approximately 8-16 micro-inches. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 m over the at least one surface and having a second average surface roughness of below 10 micro-inches, wherein the second average surface roughness is less than the first average surface roughness.

Described is a venting device including a flexible outer covering defining an outer surface and an inner surface, a set oc of helicoidal venting strips, and a set of helicoidal buffers. The outer covering has a first end and a second end and a longitudinal axis therebetween. Each venting strip is anchored to the inner surface and extends substantially between the first end and the second end and the set of venting strips is arranged substantially helicoidal and defines a set of helicoidal seams therebetween. The set of helicoidal buffers includes a buffer covering an inner opening of each seam of the set of helicoidal seams where eachbuffer is configured to shield the inner opening of the corresponding seam from penetration and each buffer is anchored to at least one of the outer covering and a neighbouring venting strip of the set of venting strips.

Illustrative examples of forming and using suitably adapted materials for improving interface strength between thermoset-thermoplastic joined parts includes exposure of a thermoplastic substrate to a plasma to form an amine-functionalized substrate having amine chemical moieties disposed on a first surface. The first surface of the thermoplastic substrate is positioned adjacent to and contacts a second surface of a thermoset substrate to form a workpiece. The thermoset substrate includes epoxide chemical moieties on and within material forming the thermoset substrate. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first surface of the thermoplastic substrate and the second surface of the thermoset substrate. Thereafter, additional thermoplastic components can be fusion bonded to a surface of the thermoplastic substrate opposite the first surfacethereby providing improved attachment of additional thermoplastic components to the thermoset substrate.