Organic light emitting diode (OLED) devices are disclosed that include a first layer; a backfill layer having a structured first side and a second side; a planarization layer having a structured first side and a second side; and a second layer; wherein the second side of the backfill layer is coincident with and adjacent to the first layer, the second side of the planarization layer is coincident with and adjacent to the second layer, the structured first side of the backfill layer and structured first side of the planarization layer form a structured interface, the refractive index of the backfill layer is index matched to the first layer, and the refractive index of the planarization layer is index matched to the second layer.

An article including a durable, optically transparent, and superhydrophobic coating is described. In one aspect, the present disclosure provides an article comprising a substrate, and disposed adjacent the substrate, a layer comprising graphitic carbon, diamond-like carbon, and aerogel. In another aspect, the present disclosure provides a method for preparing a coated substrate, comprising providing a carbon layer disposed on a substrate and having a textured surface; and disposing aerogel adjacent to at least a portion of the textured surface.

Organic light emitting diode (OLED) devices are disclosed that include a first layer; a backfill layer having a structured first side and a second side; a planarization layer having a structured first side and a second side; and a second layer; wherein the second side of the backfill layer is coincident with and adjacent to the first layer, the second side of the planarization layer is coincident with and adjacent to the second layer, the structured first side of the backfill layer and structured first side of the planarization layer form a structured interface, the refractive index of the backfill layer is index matched to the first layer, and the refractive index of the planarization layer is index matched to the second layer.

A building panel with a surface layer including a wood veneer, a wood fibre based core and a sub-layer between the surface layer and the core. The sub-layer includes wood fibres and a binder. The surface layer has surface portions including material from the sub-layer. The surface portions including material from the sub-layer extend into the wood veneer.

An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

A method of producing a veneered element, including providing a substrate, applying a sub-layer on a surface of the substrate, applying a veneer layer on the sub-layer, and applying pressure to the veneer layer and/or the substrate, such that at least a portion of the sub-layer permeates through the veneer layer. Also, such a veneered element.

A molded resin product includes a design layer including a decorative layer having a first color, a shielding layer having a second color different from the first color, and a resin base layer. A cover layer formed of a polymer film is disposed close to one end of the design layer. Part of the decorative layer exposed from the shielding layer serves as an exposed region. The exposed region and part of the shielding layer constitute a pattern portion presenting a predetermined figure or character when viewed in plan through the cover layer. The rest of the shielding layer constitutes a base portion. The layer thickness of the base portion is set smaller than the layer thickness of the pattern portion in a region thereof where the shielding layer is formed.

A glass sealing system includes a glass portion and a first adhesive layer disposed along an exterior surface of the glass portion. The glass sealing system also includes a cover with a first surface secured to the first adhesive layer and a second surface opposing the first surface. The glass sealing system includes a second adhesive layer disposed on the second surface and configured to secure the cover to a support structure. The cover obscures the second adhesive layer from view of a user looking through the glass portion toward the support structure.

The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatuses may include a pattern roll including a pattern element protruding radially outward. The pattern element includes a pattern surface and includes one or more channels adjacent the pattern surface. The pattern roll may be positioned adjacent an anvil roll to define a nip between the pattern surface and the anvil roll, wherein the pattern roll is biased toward the anvil roll to define a nip pressure between pattern surface and the anvil roll. As substrates advance between the pattern roll and anvil roll, the substrates are compressed between the anvil roll and the pattern surface to form a discrete bond region between the first and second substrates. As such, during the bonding process, some yielded substrate material flows from under the pattern surface and into the channel to form a channel grommet region.