A fiber reinforced resin molded article includes an impregnated site made up only from a fiber reinforced resin layer, and a functional site made up from a resin layer for molding that does not contain reinforcing fibers. The functional site is set to be thicker than the impregnated site.

A fiber reinforced resin molded article includes a fiber reinforced resin layer, and a functional site made up from a resin layer for molding that does not contain reinforcing fibers. An insert member is retained in an integrated manner in the functional site.

The present invention provides methods for uniform growth of nanostructures such as nanotubes (e.g., carbon nanotubes) on the surface of a substrate, wherein the long axes of the nanostructures may be substantially aligned. The nanostructures may be further processed for use in various applications, such as composite materials. For example, a set of aligned nanostructures may be formed and transferred, either in bulk or to another surface, to another material to enhance the properties of the material. In some cases, the nanostructures may enhance the mechanical properties of a material, for example, providing mechanical reinforcement at an interface between two materials or plies. In some cases, the nanostructures may enhance thermal and/or electronic properties of a material. The present invention also provides systems and methods for growth of nanostructures, including batch processes and continuous processes.

Devices, systems and techniques are described for producing and implementing articles and materials having nanoscale and microscale structures that exhibit superhydrophobic, superoleophobic or omniphobic surface properties and other enhanced properties. In one aspect, a surface nanostructure can be formed by adding a silicon-containing buffer layer such as silicon, silicon oxide or silicon nitride layer, followed by metal film deposition and heating to convert the metal film into balled-up, discrete islands to form an etch mask. The buffer layer can be etched using the etch mask to create an array of pillar structures underneath the etch mask, in which the pillar structures have a shape that includes cylinders, negatively tapered rods, or cones and are vertically aligned. In another aspect, a method of fabricating microscale or nanoscale polymer or metal structures on a substrate is made by photolithography and/or nano imprinting lithography.

A member for use in undersea applications comprising a plurality of conduits assembled into a bundle; the bundle being wrapped with a pressure-sensitive tape comprising a backing, a layer of corrosion-resistant filaments on one surface of the backing, and pressure-sensitive adhesive layer that coats the filaments and binds them to the backing.

This disclosure includes fiber-reinforced composites including and/or formed in part from fibrous non-woven layers, stacks of layers that can be consolidated to form such composites, articles, such as portable electronic device housing panels, including such composites, and methods for making such composites and articles. In some composites, at least one of the non-woven layer(s) includes: (1) a first thermoplastic material that may be present as a first set of resin fibers; (2) a second thermoplastic material that may be present as a second set of resin fibers, the second thermoplastic material having a transition temperature and/or a low-shear viscosity that is higher than that of the first thermoplastic material; (3) a first set of reinforcing fibers; and/or (4) a second set of reinforcing fibers of a type distinct from that of the first set of reinforcing fibers.

The invention relates to a blank for compression moulding a part in a compression mould comprising one or more moulding recesses, said blank comprising a body formed from a first moulding compound comprising a fibrous reinforcement material and a thermo-curable resin material, and a region located on the surface of the body formed from a second moulding compound; said second moulding compound comprising a fibrous reinforcement material and a thermo-curable resin material, and exhibiting increased flow at one or more temperatures between 20 C. and the cured Tg of the first moulding compound compared to the flow of the first moulding compound at the same temperature.

The invention aims to provide a tape-shaped prepreg including unidirectionally oriented reinforcing fibers and a thermoplastic resin composition and being high in handleability during molding and high in adhesiveness to other members. The tape-shaped prepreg includes unidirectionally oriented reinforcing fibers and a thermoplastic resin composition and has an arithmetic average roughness (Ra) of 0.1 to 10 ?m in a direction perpendicular to the orientation direction of the reinforcing fibers, as measured according to JIS B 0601: 2013, and a warpage rate of 5% or less as determined by the procedure specified in (i) to (iii) below: (i) place a test piece of the above tape-shaped prepreg having a length of 100 mm in the fiber orientation direction on a plane in such manner that the end portions curl upward, (ii) measure the vertical distance from the highest position at the right end of the curled tape to the plane, which is denoted by a, and the vertical distance from the highest position at the left end to the plane, which is denoted by b, and calculate the arithmetic average of a and b, which is defined as the warpage distance, and (iii) calculate the warpage rate by the following equation: warpage rate (%)=warpage distance (mm)/100 (mm)?100.

A method of producing a veneered element, including providing a substrate, applying a sub-layer on a surface of the substrate, applying a veneer layer on the sub-layer, and applying pressure to the veneer layer and/or the substrate, such that at least a portion of the sub-layer permeates through the veneer layer. Also, such a veneered element.

Described herein is a building panel comprising a body, the body comprising: a fiber; a latex binder present in an amount ranging from about 3 wt. % to about 10 wt. % based on the total weight of the body; and an inorganic particle having an average particle size ranging from about 1 micron to about 13 microns; wherein the inorganic particle and the binder are present in a weight ratio ranging from about greater than 1:1 to about 6:1.