A microbial growth and dust retardant roofing shingle comprising a substrate and a pore filling composition applied on the surface of the substrate is disclosed. The pore filling composition comprises a silane or acrylic composition. A method of protecting a substrate from microbial growth and soiling using the pore filling composition of the present disclosure is also disclosed.

A method of forming a composite product is described. An example of the method comprises providing a layer (34) comprising a sheet-form moulding material and providing a substrate (36). The layer of sheet-form material is applied onto a surface of the substrate (36); and pressed to the substrate in a mould (30). In some examples, the substrate (36) is an open celled foam and gas and/or vapour can be displaced from the pressing region.

A carbon film coating structure and a method for coating that structure onto a work are provided, in which a carbon material such as a carbon nanotube is applied to a work for coating thereof with high density and high integration so that the coating has an outstanding electrical conductivity and thermal conductivity, heat resistance, high strength and flexibility owing to the characteristics of carbon, and in which a carbon such as CNT is applied to the work for coating thereof easily and inexpensively, and with high density and high integration. A carbon material is coated or impregnated on a surface layer of a work. The work can deposit a suboxide or oxide containing metal ions. A porous primary film is formed on the surface layer of the work. The carbon film is coated or impregnated on an irregular part of the surface layer of the primary film.

A roll excellent in abrasion resistance, which contains: a resin layer containing a first atom group having a plurality of sulfur atoms, a plurality of second atom groups having a carbon chain that has a plurality of carbon atoms arranged in a line and has an end bonded to any one of the plurality of sulfur atoms, and a plurality of third atom groups each of which has a urethane bond and is bonded to any one of the plurality of second atom groups; and a cylindrical foamed resin having an outer surface covered with the resin layer.

In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.

Implantable devices such as stents, coils, implantable contraceptives, vascular plugs, vena cava filters, left atrial appendage (LAA) closure devices employing an adhesive component to assist in securing or holding the implant in place within a lumen of a patient's body.

A functional polymer membrane of the present invention contains a polymer containing at least a structure represented by the following Formula (I), a method for producing the membrane, and an ion exchange apparatus: ##STR00001##
wherein R.sup.1 and R.sup.2 each represent a hydrogen atom or an alkyl group; R.sup.3 to R.sup.6 each represent a substituent; R.sup.3 to R.sup.6 may be bonded to each other and form a ring; A.sup.1 to A.sup.4 each represent a single bond or a divalent linking group; M.sup.1 represents a hydrogen ion, an organic base ion, or a metal ion; J.sup.1 represents a single bond, O, S, SO.sub.2, CO, CR.sup.8R.sup.9, or an alkenylene group, and R.sup.8 and R.sup.9 each represent a hydrogen atom, an alkyl group, or a halogen atom; and k1, k2, k3, k4, n1, n2, m1, m2, p, and q each represent a particular integer.

Several embodiments of the present technology are directed to bonding sheets having enhanced plasma resistant characteristics, and being used to bond to semiconductor devices. In some embodiments, a bonding sheet in accordance with the present technology comprises a base bond material having one or more thermal conductivity elements embedded therein, and one or more etched openings formed around particular regions or corresponding features of the adjacent semiconductor components. The bond material can include PDMS, FFKM, or a silicon-based polymer, and the etch resistant components can include PEEK, or PEEK-coated components.

Provided are a magnetic field shield sheet for a wireless charger, a method of manufacturing the sheet, and a receiver for the wireless charger by using the sheet. The sheet includes at least one layer thin magnetic sheet made of an amorphous ribbon separated into a plurality of fine pieces; a protective film that is adhered on one surface of the thin magnetic sheet via a first adhesive layer provided on one side of the protective film; and a double-sided tape that is adhered on the other surface of the thin magnetic sheet via a second adhesive layer provided on one side of the double-sided adhesive tape, wherein gaps among the plurality of fine pieces are filled by some parts of the first and second adhesive layers, to thereby isolate the plurality of fine pieces.

A composite material, a high-frequency circuit baseboard made therefrom and a production method thereof. The composite material comprises: a dispersed emulsion of fluoropolymer with a low dielectric loss; a porous, expanded polytetrafluoroethylene film; and a powdery packing. The high-frequency circuit baseboard made from the composite material comprises: several laminated sheets of prepreg made from the composite material, and copper foils pressed over the two properties sides thereof. The baseboard uses a porous ePTFE film with excellent dielectric as a carrier material, which can lower the dielectric constant and dielectric loss angle tangent of the composite material and high-frequency circuit baseboard. The dielectric constant of the high-frequency circuit baseboard and prepreg is isotropic in both X and Y directions. The thickness of the prepreg can be regulated by employing porous ePTFE films with a different thickness, which avoids cracking.