A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

The present invention relates to adhesives that are suitable for use in a broad variety of bonding applications. In particular, the present invention relates to adhesives that are suitable for use in polymer-to-metal, for example elastomer-to-metal, such as rubber-to-metal bonding applications, wherein the adhesives comprise at least one halogenated polyolefin, at least one epoxysilane having at least one terminal alkoxy silane group, at least one bis-silane, and optionally at lease one organic solvent.

A composition includes: a polythiol compound; a compound having plural epoxy groups; a radical generator; and an amine-based catalyst. In the composition, the ratio (Ep/SH (epoxy groups/thiol groups)) of the total molar number (Ep) of epoxy groups contained in the compound having plural epoxy groups to the total molar number (SH) of thiol groups contained in the polythiol compound is 0.50 or higher but lower than 2.00.

A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Polymeric compositions and processes of forming the same are discussed herein. The processes generally include contacting a polylactic acid with a reactive modifier selected from epoxy-functionalized polybutadiene, ionic monomer, and combinations thereof.

Protection barriers, such as floor protection barriers, and methods for making and using same. The protection barrier can include a base sheet and an energy absorbing layer. The base sheet can have two or more paperboard layers and one or more sizing layers. A first paperboard layer can form a first surface of the base sheet, a second paperboard layer can form a second surface of the base sheet, and the one or more sizing layers can be disposed between the first and second paperboard layers. The energy absorbing layer can be secured to the second paperboard layer.

In a method for manufacturing lamination stacks of controlled height in a tool, starting, material is provided as continuous strip delivered from a coil or as an individual sheet. Laminations are punched from the starting material in several punching steps to a required contour of the laminations. A heat-curing adhesive is applied onto the laminations prior to performing a last punching step. The laminations are combined to a lamination stack. The laminations of the lamination stack are partially or completely heated in a lamination storage. The adhesive is liquefied by heating the lamination stack to build up adhesion and then solidified. Curing the adhesive at the liquefying temperature or solidifying the adhesive in the tool by cooling and subsequently heating the adhesive to a temperature below the liquefying temperature is possible so that the adhesive does not melt but undergoes further curing resulting in higher temperature stability.

A dry film includes a carrier film, a thermosetting resin composition layer, and a photocurable resin composition layer formed between the carrier film and the thermosetting resin composition layer. The thermosetting resin composition layer is formed by applying and drying a thermosetting resin composition. The photocurable resin composition layer is formed by applying and drying a photocurable resin composition. A method of producing a printed writing board includes forming a resin insulation layer which includes a thermosetting resin composition layer and a photocurable resin composition layer on the substrate, in the order of the thermosetting resin composition layer and the photocurable resin composition layer from a surface side of the substrate, patterning the resin insulation layer by photolithographic approach, and patterning the resin insulation layer by laser processing.

An object having a coating produced using an adhesion promoter, wherein the adhesion promoter comprises at least one, optionally oligomeric, addition product having no terminal CC double bonds and having hydrolyzable silane groups.

A process for making highly mechanical and chemical resistant ceramic substrates, especially tiles is provided, wherein the process comprises coating said substrates with a base coat layer of a thermosetting or radiation curable powder coating composition, curing the applied powder coating composition, and applying a further layer of a liquid coating composition and curing the composition by exposure to heat. Coated ceramic substrates, in particular tiles are also provided.