Patent classifications
Y10T428/31529
Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.
Bonded metal and thermoplastic components
A method for bonding components is provided. The method includes preparing a surface of a metal component, applying a film adhesive to the prepared surface, forming a thermoplastic component using injection molding such that the film adhesive is positioned between the metal component and the thermoplastic component, and curing the film adhesive.
COATING FILM AND AUTOMOTIVE PART ON WHICH COATING FILM IS FORMED, AND CONSTANT VELOCITY UNIVERSAL JOINT
The invention provides a coating film having excellent adhesion, even without a chemical conversion film treatment being carried out as an undercoat treatment, and a metal automotive part having the coating film. A powder is deposited by powder-coating onto the surface of a metal automotive part that has been quenched after forging, and tempering of the metal automotive part and bake-hardening of the deposited powder are carried out simultaneously, thereby forming a skin film on the surface of the metal automotive part. The surface of the metal automotive part before the powder is powder-coated thereon is a work-hardened basis material surface that has been not subjected to a chemical conversion filming treatment.
RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME
A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I):
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wherein m, n, 1, R.sub.1, and R.sub.2 are as defined in the specification.
ADHESION PROMOTER COMPOSITIONS AND PRIMER COMPOSITIONS FOR METAL-PLASTIC HYBRID COMPONENTS
The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.
Epoxy resin composition, prepreg, resin-coated metal foil, resin sheet, laminate and multilayer board
An epoxy resin composition contains a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). A polyphenylene ether (B1) having a number-average molecular weight of 500 to 3000 and an average of 1.0 to 3.0 hydroxyl groups per molecule, and an epoxy resin (B2) obtained by reacting this polyphenylene ether (B1) with an epoxy resin (D) having an average of 2.3 or fewer epoxy groups per molecule and the like, are included as the polyphenylene ether compound (B). A phosphorus-modified epoxy resin (P) is included in at least one selected from the polyfunctional epoxy resin (A), the epoxy resin (D) and a component other than the (A), (B) and (C) above. The phosphorus content is 1.5 to 4.5 mass % as a percentage of the resin solids in the epoxy resin composition.
Method for forming coating film on constant velocity universal joint
A coating film having excellent adhesion, even without the presence of a chemical conversion film treatment as an undercoat, and a metal automotive part having the coating film. A powder is deposited by powder-coating onto the surface of a metal automotive part that has been quenched after simultaneously forging, and tempering the metal automotive part and bake-hardening the deposited powder to form a skin film on the surface of the metal automotive part. The surface of the metal automotive part before the powder is powder-coated thereon is a work-hardened material surface that has not been subjected to a chemical conversion filming treatment.
Chromate free pretreatment primer
A coating comprising epoxy functional resin, corrosion resistant particles, and a multi-functional crosslinker are disclosed as are methods of using such a coating to coat at least a portion of a substrate and a substrate coated thereby.
Coating Compositions Exhibiting Corrosion Resistance Properties and Related Coated Substrates
Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.
Adhesion promoter compositions and primer compositions for metal-plastic hybrid components
The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.