A method for producing a device substrate by obtaining a laminate comprising a carrier substrate, a first polyimide film comprising a first polyimide resin disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film opposite to the surface of the first polyimide film formed on a surface of the carrier substrate; applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the cross-sections of the second polyimide film are exposed and cross-sectional surfaces of the first polyimide film are not exposed and no physical stimulus is applied to the surface of the carrier substrate, wherein the adhesive strength of the first polyimide to the second polyimide film decreases when the second polyimide film in the laminate is cut to expose cross-sectional surfaces of the second polyimide film; and separating the second polyimide film from the first polyimide film formed on the carrier substrate to obtain the device.

A laminate includes the following substantially coextensive layers in the following order: (a) a non-sealable, self-supporting, thermoformable copolyester film layer having a first surface and a second surface, the second surface constituting an outermost, exposed surface of the laminate; (b) a laminating adhesive layer on the first surface of the thermoformable copolyester film layer; and (c) a self-supporting, thermoformable structural film layer having a first surface and a second surface, the first surface contacting the laminating adhesive layer. Polyethylene terephthalate constitutes at least 80% by weight of the self-supporting thermoformable copolyester film layer; the thermoformable structural film layer includes a polymer selected from the group consisting of polyamides, polypropylene, polyethylene, polyethylene terephthalate, ionomers, ethylene acrylic acid copolymers, ethylene vinyl acetate copolymers, polystyrene, ethylene vinyl alcohol copolymers and polyvinylidene chloride; the thermoformable copolyester film layer, the structural film layer and the laminate each shrink less than 5% in length and width upon exposure to boiling water for five seconds; and the laminate is thermoformable and its chloroform-soluble extractives meet the requirements of paragraph h(1) of 21 CFR 177.1630 as defined herein.

The invention relates to a crosslinkable one-component laminating adhesive containing 25 to 80 wt. % of polyester prepolymers, polyether prepolymers and/or polyurethane prepolymers, which have at least two cross-linkable alkoxysilane groups and have a molecular weight of 2000 to 30,000 g/mol, 75 to 19 wt. % of organic solvent having a boiling point up to 130 C., 1 to 20 wt. % of polymers which contain anhydride groups, and 0 to 15 wt. % of additives, wherein the viscosity of the adhesive is between 50 and 20,000 mPas (according to DIN ISO 2555), measured at 15 to 45 C.

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200? C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

A transparent article includes a continuous polyester matrix having at least one incompatible filler dispersed therein. The incompatible filler provides domains in the polyester matrix, each domain having a particular dimension, thus providing a range of dimensions for the domains in the article. To create haze, the dimensions are within the range of from about 380 nm to about 720 nm. Once the range of dimensions is determined, a light absorbent composition can be found which absorbs light at a range of wavelengths that at least substantially covers the range of dimensions of the domains. In doing so, it has been found that the haze of the article can be substantially masked. Method for producing the article and for masking the haze are also provided.

The present invention provides an insulation film and a method for making the insulation film, comprising a film upper layer and a film lower layer, wherein both of the film upper layer and film lower layer are made of a heat conduction plastics material, the heat conduction plastics material contains a heat conduction additive; and a film intermediate layer located between the film upper layer and the film lower layer. The film intermediate layer is made of a heat conduction plastics material, and the heat conduction plastics material contains a conductive additive An upper surface of the film intermediate layer is bound together with a lower surface of the film upper layer, and a lower surface of the film intermediate layer is bound together with an upper surface of the film lower layer.

To provide a transfer material which is capable of improving the visibility of a transparent electrode pattern of an electrostatic capacitance type input device, and is capable of improving the productivity of the electrostatic capacitance type input device. A transfer material includes a temporary supporter and a transparent curable resin layer laminated on the temporary supporter, and a refractive index of the transparent curable resin layer at a wavelength of 550 nm is 1.55 or more.

A laminate includes the following substantially coextensive layers in the following order: (a) a non-sealable, self-supporting, thermoformable copolyester film layer having a first surface and a second surface, the second surface constituting an outermost, exposed surface of the laminate; (b) a laminating adhesive layer on the first surface of the thermoformable copolyester film layer; and (c) a self-supporting, thermoformable structural film layer having a first surface and a second surface, the first surface contacting the laminating adhesive layer.

The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (4) are satisfied:
10([COOH][NH.sub.2])80(1)
0.32P<6.46(2)
0.50M<17.00(3)
2M/P3(4)
wherein [COOH] represents a concentration (eq/g) of a terminal carboxyl group in the polyamide (X); [NH.sub.2] represents a concentration (eq/g) of a terminal amino group in the polyamide (X); P represents a mole concentration (mol/g) of a phosphorus atom contained per g of the polyamide resin composition; and M represents a sum (mol/g) of values obtained by multiplying a mole concentration of an alkali metal atom and a mole concentration of an alkaline earth metal atom each contained per g of the polyamide resin composition by valencies thereof respectively.

The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (3) are satisfied:
0.03P<0.32(1)
2.2M26.1(2)
5<M/P200(3)
wherein P represents a mole concentration (mol/g) of a phosphorus atom contained per g of the polyamide resin composition; and M represents a sum (mol/g) of values obtained by multiplying a mole concentration of an alkali metal atom and a mole concentration of an alkaline earth metal atom each contained per g of the polyamide resin composition by valencies thereof respectively.