A preparation method of a rapid bonding of a long silver-graphite electrical contact material and a solder strip material includes the following steps: first step, making a silver-graphite spindle into a silver-graphite electrical contact sheet material by an extrusion process; second step, performing a sintering to composite a solder strip material with the silver-graphite electrical contact sheet material to obtain a composite blank; and third step, performing a rolling and a heat treatment on the composite blank for one or more times to complete the composite of the long silver-graphite electrical contact material and the solder strip material. The method is a method for preparing a silver-based electrical contact material and solder composite material.

A method for manufacturing an electrode configuration configured for use with an electrosurgical instrument is provided. A pre-assembled jaw configuration including jaw members including respective first and second electrodes is provided. One or more stop members are positioned on the first electrode. The first and second electrodes are approximated toward one another for contact therebetween so as to form an at least one indentation on the second electrode.

A method of manufacturing a developer container including a frame configured to define a developer containing portion, a first electrode, and a second electrode arranged on a surface of the frame and having a surface opposed to the first electrode, a developer amount in the developer containing portion being detected based on a capacitance between the first electrode and the second electrode, the method including: holding a conductive resin member constituting the second electrode on a mold configured to mold the frame, a surface of the conductive resin member being in contact with a surface of the mold configured to mold a surface of the frame on a side of the developer containing portion; injecting a resin to be formed into the frame, into the mold on which the conductive resin member is held; and curing the resin to form the frame to which the second electrode is fixed.

A lead assembly includes a lead with a distal end and a proximal end. The lead includes a plurality of electrodes disposed at the distal end and a plurality of terminals disposed at the proximal end. The lead also defines at least one central lumen and a plurality of outer lumens. The central and outer lumens extend from the proximal end to the distal end such that the plurality of outer lumens extend laterally from the at least one central lumen. The lead further includes a plurality of conductive wires. Each conductive wire couples at least one of the plurality of electrodes electrically to at least one of the plurality of terminals. At least two conductive wires are disposed in each of the plurality of outer lumens.

An opto-electronic contact, method and connection system can utilize an active opto-electronic converter configured for removable optical engagement with an opposing contact. A barrel housing defines an interior cavity to capture the converter in the interior cavity for external optical engagement to the opposing contact via the first barrel opening for relative movement of the converter axis along the elongation axis, transverse thereto, and oblique thereto to accommodate mating tolerances responsive to engaging the opposing contact. A flexible circuit board assembly can be used to externally electrically interface the converter.

A preparation method of a rapid bonding of a long silver-graphite electrical contact material and a solder strip material includes the following steps: first step, making a silver-graphite spindle into a silver-graphite electrical contact sheet material by an extrusion process; second step, performing a sintering to composite a solder strip material with the silver-graphite electrical contact sheet material to obtain a composite blank; and third step, performing a rolling and a heat treatment on the composite blank for one or more times to complete the composite of the long silver-graphite electrical contact material and the solder strip material. The method is a method for preparing a silver-based electrical contact material and solder composite material.

The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

An electrode assembly for use with an electrosurgical instrument includes a pair of opposing jaw members and an electrode positioned on each jaw member. One or both of the electrodes includes a tissue contacting surface that has an outer periphery and defines a side surface depending therefrom. The tissue contacting surface and the side surface include a conjoining edge formed at a first predetermined angle that defines a first linear transition zone dimensioned to reduce arcing between the opposing jaw members during activation of the electrosurgical instrument.

An electrical connector includes a dielectric housing, a plurality of electrical signal contacts carried by the dielectric housing, and a ground plate carried by the dielectric housing. The electrical signal contacts are arranged along a first plane, wherein the signal contacts define signal pairs. The signal contacts further define respective mating and mounting ends. The ground plate includes a ground plate body oriented in a second plane that is substantially parallel to the first plane and offset from the first plane. The ground plate body defines first and second opposed surfaces. The ground plate includes at least one rib that defines first and second opposed surfaces, wherein the first surface of the rib projects from the first surface of the ground plate body in a direction toward the first plane between adjacent signal pairs, and the second surface is recessed into the second surface of the ground plate body.

A semiconductor system (900) has a flat interposer (510) with a first surface (401a) in a first plane, a second surface (401b) in a parallel second plane, and a uniform first height (401) between the surfaces; the interposer is patterned in metallic zones separated by gaps (412, 415), the zones include metal of the first height and metal of a second height (402) smaller than the first height; an insulating material fills the gaps and the zone differences between the first and the second heights. Semiconductor chips of a first (610) and a second (611) set have first terminals attached to metallic zones of the first interposer surface while the chips of the second set have their second terminals facing away from the interposer. A first leadframe (700) is attached to the second terminals of the second set chips, and a second leadframe (800) is attached to respective metallic zones of the second interposer surface.