A method includes a component mounting step of mounting components on a board; a positional deviation amount acquisition step of acquiring a positional deviation amount of each of the components mounted on the board, from a corresponding normal position; and a correction value calculation step of calculating a feedback correction value for correcting a mounting operation in the component mounting step, based on the acquired positional deviation amount. In the correction value calculation step, the feedback correction value is calculated based on the positional deviation amount of each of the components mounted in each of a plurality of division areas on the board, for each of the plurality of division areas, and in the component mounting step, the mounting operation is corrected by using the feedback correction value of the plurality of division areas in which the components are mounted.

An information management device for managing information in a mounting system that mounts a component after determining usability of the component when the component is picked up from a wafer divided into multiple components and is mounted on a base material, includes an information storage section that stores various types of information, an information acquisition section that acquires information on a pickup position of the component on the wafer and information on a determination result of usability of the component, and an information processing section that stores information obtained by associating the pickup position of the component with the determination result of the usability in the information storage section.

Methods and systems for stacking multiple chips with high speed serializer/deserializer blocks are presented. These methods make use of Through Via (TV) to connect the dice to each other, and to the external pads.

A coil component includes a core including a winding core portion and a first flange portion, a first wire and a second wire that are wound around the winding core portion in the same direction, and a first terminal electrode that is disposed on the first flange portion and that is connected to a first end portion of the first wire. The shape of an outer edge of the first terminal electrode includes a convex curve.

A component mounting system includes a plurality of component supply devices (tape feeders) each of which supplies components from a component supply position and a component mounter that sucks the components from the component supply position of each of the plurality of component supply devices with a plurality of nozzles (suction nozzles) to install the components onto a board. A suction position correction value for correcting a suction position shift from a regular suction position when each of the nozzles sucks the components from the component supply position is calculated. The suction position is corrected based on the suction position correction value to suck the components. A suction position shift amount from the regular suction position is calculated. A feeder evaluation value, which is a sum of the suction position correction value and the suction position shift amount, is calculated for each of the plurality of component supply devices.

A wire wound-type coil component with an integrated structure does not have a bonding portion where there is concern about reliability with respect to a spiral conductive wire, a terminal electrode, and an annular core. A coil component includes a core with an integrated structure, at least part of which is a winding core portion, which has an annular shape having a through-hole, and which is made of a non-conductive material; and a coil conductor with an integrated structure, which has a spiral conductive wire arranged to spirally extend around the winding core portion and first and second terminal electrodes formed at both end portions of the spiral conductive wire, respectively. The coil component is manufactured through three-dimensionally shaping the core, the coil conductor, and a shape holding member for holding a shape of a wall surface of the core defining the through-hole, by using a 3D printer.

A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and/or for imprinting the portion of the material for release and transfer from the supply.

A method of manufacturing an optical communication device includes preparing first and second pre-defined break lines in a carrier wafer. A first sub-mount is positioned near the first break line to accommodate an optical laser and a second sub-mount is positioned near the second break line to accommodate an optical modulator. The first sub-mount is secured to a thermally conductive and electrically nonconductive spacer which is secured to a thermo-electrical cooler that defines a gap between the first submount and the thermo-electrical cooler. A portion of the carrier wafer between the sub-mounts is removed.

A control device of the tape feeder includes: a step-out detecting section for detecting a step-out of a stepping motor; a memory section for storing a target angle of a sprocket for positioning one of multiple cavities at a supply section; and a restoration process section for performing origin alignment, when the step-out detecting section detects a step-out of the stepping motor, wherein pulse power is supplied to the stepping motor so that the sprocket reaches a predetermined angle, supplying the pulse power to the stepping motor in accordance with the current angle and the target angle of the sprocket after the origin alignment is completed, and moving one of the multiple cavities to the supply section.

A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.