Semiconductor packages are described which increase the density of electronic components within. The semiconductor package may incorporate interposers with cavities formed into the top and/or bottom. The cavities may then be used as locations for the electronic components. Alternatively, narrow spacer interposers may be used to space apart standard more laterally elongated interposers to form the indentations used to house the electronic components. The semiconductor package designs described herein may be used to reduce footprint, reduce profile and increase electronic component and transistor density for semiconductor products.

An integrated circuit package comprising a first substrate having a cavity; a second substrate; and one or more semiconductor device(s) and/or passive component (s) are coupled to the second substrate. The cavity is formed using two opposite side walls of the first substrate where two opposite sides of the cavity are kept open, the one or more semiconductor device(s) and/or passive component(s) is/are electrically coupled using redistribution layers, and the second substrate is located inside the cavity of the first substrate.

A cable processing machine apparatus includes a cable processing machine for processing a cable, in particular a crimping machine for connecting a cable to a crimp contact by a crimping connection, and a handling robot that includes a gripping arm for gripping a portion of the cable or of multiple cables and moving the cable(s) into the cable processing machine and/or out of the cable processing machine.

A component chuck device moves a pusher member downward when negative pressure is supplied, and holds a posture of a component by causing the pusher member to abut with an upper face of the component that is gripped in a gripping mechanism. Then, the component chuck device releases gripping of the component when supply of negative pressure is stopped, and a lead of the component is inserted into a hole of a substrate while holding the posture of the component by moving the pusher member downward while remaining abutted with the upper face of the component.

A component mounting device for mounting a component on a substrate comprises a pair of clamping members pinching and clamping the component; the pair of clamping members is able to clamp both a first component including a first body and a first lead projecting downward from a lower portion of the first body and a second component including a second body and a second lead projecting laterally from both side portions of the second body with a tip bent downward; and the pair of clamping members has facing portions each provided with a clamping surface contacting the first body of the first component and a holding groove formed at the clamping surface and holding the second lead of the second component.

An insertion head includes: a horizontal shaft member; one pair of gripping claws, extending on a surface orthogonal to the horizontal shaft member; one pair of gripping claw holding members movable on the horizontal shaft member which hold the one pair of gripping claws; a swing mechanism which rotates and drives the shaft member, and swings the one pair of gripping claw holding members around a center axis of the shaft member; and an interval changing mechanism which moves the one pair of gripping claw holding members on the shaft member and changes an interval between the one pair of gripping claws. The gripping claw extends to be bent on the surface, and each straight line portion of each tip end is offset to a perpendicular axis extending on the surface through a center axis of the shaft member in a posture of being oriented downward.

An insertion head includes: a horizontal shaft member; one pair of gripping claws, each gripping claw extending on a surface which is orthogonal to the horizontal shaft member; one pair of gripping claw holding members which are provided to be movable on the horizontal shaft member, and hold the one pair of gripping claws; a swing mechanism which rotates and drives the horizontal shaft member, and swings the one pair of gripping claw holding members around a center axis of the horizontal shaft member; and an interval changing mechanism which moves the one pair of gripping claw holding members on the horizontal shaft member and changes an interval between the one pair of gripping claws. A leaded component is gripped with the one pair of gripping claws, and a lead of the leaded component is inserted into an insertion hole on a printed circuit board.

Methods of forming secured substrates are presented. These methods involve creating signal-blocking vias and a series of meshes on various layers of an electronic substrate to mask signal traces and prevent tampering. By strategically positioning ground and power meshes on different layers, and optionally including dummy meshes, the method significantly increases the privacy and security of the electronic substrate. These techniques can also be applied inside or on integrated circuits to enhance security.

An integrated circuit package including a substrate having a cavity and one or more semiconductor devices assembled within the cavity of the substrate. The one or more semiconductor devices electrically coupled using redistribution layers, wherein the cavity is a first cavity, the substrate includes the first cavity and a second cavity, the one or more semiconductor devices are fully embedded within the first cavity of the substrate, the one or more semiconductor devices are fully embedded between the substrate and a first redistribution layer of said redistribution layers, bumps are fully embedded within the second cavity of the substrate, the bumps are fully embedded between the substrate and the first redistribution layer of said redistribution layers, and the first redistribution layer is fully embedded between the substrate and a semiconductor interposer.

Provided is a method for mounting an electronic component having a plurality of board insert type leads on a board. The method includes a holding process which chucks one of the plurality of leads of the electronic component to hold the electronic component, and an inserting process which inserts the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.