Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongate carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

A method of forming a composite article is disclosed that involves providing a press having first and second platens, a cellulosic fiber substrate having a first thickness, and a layer of material such as a wood veneer, foil, or non-creped paper, where the layer of material has a thickness less than the thickness of the cellulosic fiber substrate. A layer of bonding material is placed onto the cellulosic fiber substrate or the layer of material, and the layer of material is placed onto the cellulosic fiber substrate so that the bonding material is between the layer of material and the cellulosic fiber substrate. The cellulosic fiber substrate and layer of material are placed between the first and second platens, and at least one of the first and second platens is moved toward the other of the first and second platens to deform the cellulosic fiber substrate and layer of material into a predetermined configuration while bonding the layer of material to the cellulosic fiber substrate without cracking or wrinkling the layer of material.

Methods of preparing adhesive-backed articles and methods of applying adhesives backed articles are described. The adhesive-backed articles include a compliant film and a pressure-sensitive adhesive having a microstructured surface opposite the compliant film.

An apparatus for the production of a paper web, includes: a first embossing unit (1) with a first embossing cylinder (2) and a corresponding counter-cylinder (3) for embossing a first paper ply (4); a second embossing unit (5) with a second embossing cylinder (6) and a corresponding counter-cylinder (7) for embossing a second paper ply (8), such that, once embossed, the plies have a series of oppositely oriented reliefs (R4, R8), the embossing units (1, 5) being synchronized so that the reliefs are nested into each other; a sizing unit (1C, 2C, 3C) associated with the first embossing cylinder (2) to distribute a predetermined amount of glue on the side of the second ply (8) opposed to that from which the respective reliefs (R8) emerge; a structure (11) for joining to each other the plies (4, 8) exiting from the apparatus.

Aspects of the present invention relate to methods of making an external nasal dilator amenable to continuous and automated manufacture. For example, in one embodiment of the method, a roll of a three-layered material is used as the starting material, the three layers consisting substantially and respectively of (1) a resilient sheet, (2) an adhesive-protecting sheet, and (3) an adhesive layer between the resilient sheet and the adhesive-protecting sheet. A series of dies are used to cut the three-layered material into the appropriate shape and (when necessary) to impress grooves in the resilient sheet.

The present invention is method for forming a sandwich structure having a pattern of particulate material enveloped between a carrier material and a cover material. The method allows accurate forming of pre-determined pattern at high production speed. Such a method is particularly useful in the manufacture of disposable absorbent articles, such as baby diapers.

The present invention relates to a method of applying absorbent gelling material (AGM) granules by indirect printing onto an carrier layer for use in an absorbent article, particularly diaper for babies or adults, training pants, pull-up diapers (diaper pants), sanitary napkins, panty liners or the like. These articles typically comprise the carrier layer with the AGM particles together with further layers, making up the complete article.

An absorbent article having improved softness signals is disclosed. The article may include a topsheet or a backsheet including a nonwoven web. The web may have a basis weight of 30 gsm or less, may be formed of spunlaid fibers including polyolefin and up to 5 percent by weight TiO.sub.2, and may be impressed with a pattern of bond impressions to a bond area percentage of at least 10 percent forming a pattern of bonded regions and raised regions. The web may have opacity of 42 or greater; have an average height difference between bonded regions and raised regions of at least 280 m; be hydroengorged; and/or have a cross-direction tensile strength of 350 gf/cm. A nonwoven web manufactured to have a suitable combination of such features exhibits an enhanced appearance of softness, soft tactile feel and satisfactory mechanical attributes, while being relatively cost effective.

The present invention provides a flexible nanoimprint mold which can fabricate sub-15 nm ultra fine structures on either planar or curved substrates. The mold comprises a top ultra-thin rigid layer of imprint patterning features and a bottom thick flexible layer of polymer elastomer. The two distinct layers are preferably integrated via chemically bonding. The top layer of the mold enables a sub-15 nm resolution of pattern fabrication and the bottom layer affords a conformal contact to planar or curved surface of substrates. The methods for fabricating the same are disclosed.