Electrochromic device laminates and their method of manufacture are disclosed.

The present disclosure relates to methods and apparatuses for assembling absorbent articles, and more particularly, methods and apparatuses for severing elastic in an advancing elastic laminate. A continuous elastic laminate may be formed by bonding elastic strands between a first continuous substrate layer and a second continuous substrate layer. As discussed in more detail below, the continuous elastic laminate may advance through a cutting apparatus that intermittently deactivates or severs the elastic strands of the elastic laminate along the machine direction.

A solid electrolytic capacitor comprising a capacitor element disposed on an insulating substrate, in which a positive electrode lead-out structure electrically connected to a positive electrode member of the capacitor element comprises a first positive electrode connection member disposed on the insulating substrate, a positive electrode terminal disposed on the insulating substrate, a pillow member configured to electrically connect the positive electrode member to the first positive electrode connection member, and a positive electrode bonding member. The first positive electrode connection member has a recessed portion or a through hole. The positive electrode bonding member partially enters the recessed portion or the through hole, and is in contact with an edge of a bottom surface of the pillow member at a position above the recessed portion or the through hole, or at the nearby position.

A beaded composite panel is fabricated using composite plies. An opening is formed in each of plies, and each ply is laid up on a bead feature and drawn down over the bead feature in the area of the opening so as to widen the opening into a gap allowing the ply to conform to the contour of the bead feature. Patches are fabricated and placed on the plies overlying over the openings. The laid-up plies are compacted and cured.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.

A semi product for building panels or structural elements comprising several wood lamellas (5) fixed by distance elements (4), a building panel with such a semi product and a method of producing the semi product and the building panel. A method of producing a semi-product for a structural element or for a core for a building panel, wherein the method comprises the step of: attaching at least two distance strips by an adhesive to a first wood board; attaching a second wood board to the distance strips by an adhesive; and cutting the first and the second wood boards and the distance strips in the length direction of the wood boards.

A support for installing facing materials such as ceramic tiles on a substrate, such as, floors, walls and ceilings. The support plate has a plurality of spaced apart raised portions and recesses in the plate material, and a plurality of openings extending through the top surface and bottom surface of the plate material. The openings exposing a mat layer attached to the bottom of the support plate. Support plates of the invention are used for tile installations between a substrate and tile. Thin-set mortar that is used to secure the tile to the support plate flows into the recesses and into the openings forming a continuous bond between the mortar, openings and mat layer to provide a strong bond between the support plate, mortar and the tiles.

According to an embodiment of the present disclosure, a method of labeling a plurality of products includes coating a pressure sensitive adhesive to a roll of face stock, the roll of face stock configured to be converted to a plurality of individual labels aligned in a single lane; singulating an individual label from the roll of face stock; and applying the individual label to a product of the plurality of products, wherein the coating, singulating and applying are conducted sequentially in a single continuous operation with a single continuous web of material.

A support for installing facing materials such as ceramic tiles on a substrate such as floors, walls and ceilings wherein the support plate has a plurality of spaced apart recesses in the plate material, with the recesses being open at the top surface and have solid sidewalls and a base, and a plurality of slots in the non-recessed portions of the plate material extending through the top surface and bottom surface, the slots joining one or more adjacent recesses. The support plate of the invention is used for tile installations between the substrate and such tile. Thin-set mortar that is used to secure the tile to the support plate flows into the recesses and into the slots forming a continuous bond between the mortar and the adjacent slots providing for a strong bond between the support plate, mortar and the tiles.