A method of manufacturing a core stiffened structure includes orienting the plurality of core wafers in a non-uniform pattern onto a first face sheet, the non-uniform pattern producing non-uniform spacing between adjacent core wafers; assembling a second face sheet onto the plurality of wafers; and curing an adhesive to create a bond between the plurality of wafers, the first face sheet, and the second face sheet.

It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.