Disclosed herein is an apparatus for removing material from a surface of a carrier. The apparatus comprises a buckling mechanism that comprises a gripper configured to engage the material. When engaged with the material, the gripper is movable relative to the surface of the carrier to move the material relative to the surface of the carrier and to form a buckle in the material. The apparatus also comprises a separation mechanism that is coupled to the buckling mechanism and comprises a wedge that is movable relative to the surface of the carrier to be insertable into the buckle formed in the material.

A method of reducing label waste that employs a stand-alone or printer attached apparatus for cleanly and efficiently cutting a web of media or tag stock into individual units. The apparatus used by the method may cut vinyl, plastic, or RFID stock material in both back and forth directions without sacrificing cut quality, and preferably comprises a housing, a carriage assembly and a movable cutter assembly. The cutter assembly comprises a cutting element such as a wheel blade, and a pressure adjusting element for adjusting the amount of pressure applied by the cutting element to the stock material. Alternatively, the cutter assembly may be manufactured with a predetermined pressure load, but still permit an operator to adjust the depth of cut. The method involves using the cutting apparatus to make a series of cuts as the label material is incrementally advanced through the cutting apparatus.

A stand-alone apparatus for cutting a web of media or tag stock into individual units for use downstream of a printer. The apparatus may cut vinyl, plastic, or RFID stock material in both back and forth directions. The apparatus comprises a housing, a carriage assembly and a movable cutter assembly. The cutter assembly is easily interchangeable and comprises a cutting element such as a wheel blade, and a pressure adjusting element for adjusting the amount of pressure applied by the cutting element to the stock material. Alternatively, the cutter assembly may be manufactured with a predetermined pressure load, but still permit an operator to adjust the depth of cut. The apparatus may be powered by and or in hardline or wireless communication with a printer, or may further comprise a computer microprocessor, memory and user interface to function wholly independent from a printer.

A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

The present invention provides a support for temporary bonding a workpiece such as a thick device wafer. The support comprises a carrier having a supporting surface and an isolation film. A first side of the isolation film is bonded to the supporting surface with a peeling strength of from 0.01 to 50.0 g/cm. The invention also provides a method of using the support to e.g. grind the workpiece in making thinned products such as thin silicon wafer, optical lens, thin LCD glass, and thin rock crystal wafer, among others.

A stand-alone apparatus for cutting a web of media or tag stock into individual units for use downstream of a printer. The apparatus may cut vinyl, plastic, or RFID stock material in both back and forth directions. The apparatus comprises a housing, a carriage assembly and a movable cutter assembly. The cutter assembly is easily interchangeable and comprises a cutting element such as a wheel blade, and a pressure adjusting element for adjusting the amount of pressure applied by the cutting element to the stock material. Alternatively, the cutter assembly may be manufactured with a predetermined pressure load, but still permit an operator to adjust the depth of cut. The apparatus may be powered by and or in hardline or wireless communication with a printer, or may further comprise a computer microprocessor, memory and user interface to function wholly independent from a printer.

A method for disassembling a stack of at least three substrates. The invention relates to the techniques for transferring thin films in the microelectronics field. It proposes a method for disassembling a stack of at least three substrates having between them two interfaces, one interface of which has an adhesion energy and an interface of which has an adhesion energy, with less than, the method comprising: 1) implementing a removal of material on the first substrate, in order to expose a surface of the second substrate, 2) transferring the stack onto a flexible adhesive film so that the surface has, with an adhesive layer of the film, an adhesion energy greater than, and 3) disassembling the third substrate at the interface between the second substrate and the third substrate. The method makes it possible to open the stack via the interface thereof with the highest adhesion energy.

Disclosed herein is an apparatus for removing material from a surface of a carrier. The apparatus comprises a buckling mechanism that comprises a gripper configured to engage the material. When engaged with the material, the gripper is movable relative to the surface of the carrier to move the material relative to the surface of the carrier and to form a buckle in the material. The apparatus also comprises a separation mechanism that is coupled to the buckling mechanism and comprises a wedge that is movable relative to the surface of the carrier to be insertable into the buckle formed in the material.

A blade includes an edge to be pressed against an end portion of a carrier film to fold the end portion upwards from a sheet. A clamp mechanism peels the carrier film off from the sheet by moving while clamping the upwardly folded end portion of the carrier film.

In debonding a temporarily adhesive-bonded carrier-workpiece pair by a combination of chemical and mechanical methods, solvents or chemicals are used to remove the adhesives primarily through dissolution, and a thin wire, filament, or blade is used to exert a cutting or wedging action between the carrier and workpiece. The two methods are used together during the debonding process. In the carrier-workpiece pair, the workpiece can be a semiconductor wafer that has been thinned and processed. The carrier and the workpiece are temporarily bonded using an adhesive dissolvable in a selected chemical or solvent. The chemical and mechanical debonding (CMDB) method can be carried out in solvent immersion or in solvent spray to provide high throughput debonding. The dissolved adhesives can be recycled and later reused, thus lowering the cost of the whole bonding and debonding process.