A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

The present invention relates to a punch foot (1) for a label punch (2) of a device (3) for labeling individual packs (4), having a punch foot housing (5) which in an extent direction (E) extends from a first housing end (5a) having a first housing opening (6a) to a second housing end (5b) having a second housing opening (6b); having a pressure duct (7) which in the punch foot housing (5) extends from the first housing opening (6a) in the extent direction (E); having a perforated plate (8) which closes the second housing opening (6b) and is connected to the punch foot housing (5), by way of which at least one primary nozzle (9) extends in an orientation direction (V); having a pressure chamber (10) which in the punch foot housing (5) extends from the perforated plate (8) counter to the extent direction (E) and which in a manner orthogonal to the extent direction (E) is on all sides delimited by a punch foot housing wall portion (11); having a connection portion (12) which in the punch foot housing (5) in the extent direction (E) extends between the pressure duct (7) and the pressure chamber (10) and which connects the pressure duct (7) to the pressure chamber (10); and having a control element (13) which is disposed in the pressure chamber (10) and which is movable between two terminal positions (I, II) that effect dissimilar flows through the pressure chamber (10); whereby the at least one primary nozzle (9) connects the pressure chamber (10) to the environment of the punch foot housing (5). In order for the handling to be simplified, the invention proposes that at least one secondary nozzle (14) which connects the pressure chamber (10) to the environment of the punch foot housing (5) extends through the punch foot housing wall portion (11) that delimits the pressure chamber (10) on all sides in a manner orthogonal to the extent direction (E). The invention furthermore relates to a device (3) and to a method for labeling individual packs (4).

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

The use of a heat idler moveable along a path provides speed and flexibility in the heat labeling of containers.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A label applying apparatus and a related method are provided. The label applying apparatus may include a label applicator and a receptacle. The label applicator may include a displaceable piston with an applicator surface configured to receive a label. The receptacle may include walls that define an interior compartment. Further the receptacle may include a pivotable cover member that pivots about a hinge between a closed position that covers an upper opening of the receptacle and an open position in which articles of material may be inserted into the interior compartment. The distal end of an upper portion of the pivotable cover member may engage the articles such that the articles are retained in a position whereby the displaceable piston extends into the interior compartment and applies a label to a label application surface of the most proximate one of the articles to the applicator surface of the displaceable piston.